Electronic device including coil

ABSTRACT

A portable communication device is provided. The portable communication device includes near field communication (NFC) circuitry; wireless charging circuitry; magnetic secure transmission (MST) circuitry; a flexible printed circuit board (FPCB) including a first substrate layer and a second substrate layer; an NFC coil electrically connected with the NFC circuitry, the NFC coil including a first portion formed on the first substrate layer and a second portion formed on the second substrate layer; a wireless charging coil electrically connected with the wireless charging circuitry, the wireless charging coil including a third portion formed on the first substrate layer and a fourth portion formed on the second substrate layer; and an MST coil electrically connected with the MST circuitry, the MST coil including a fifth portion formed on the first substrate layer and a sixth portion formed on the second substrate layer.

PRIORITY

This application is a Continuation of U.S. Ser. No. 16/600,059, whichwas filed in the U.S. Patent and Trademark Office on Oct. 11, 2019,which is a Continuation of U.S. Ser. No. 15/416,861, which was filed inthe U.S. Patent and Trademark Office on Jan. 26, 2017, issued as U.S.Pat. No. 10,592,893 on Mar. 17, 2020, and claims priority under 35U.S.C. § 119(a) to Korean Patent Application Serial No. 10-2016-0014440,which was filed in the Korean Intellectual Property Office on Feb. 4,2016, the entire content of each of which is incorporated herein byreference.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates to an electronic device including a coiland, more particularly, to an electronic device including a coil capableof discharging a magnetic field when a current is applied.

2. Description of the Related Art

These days, electronic devices including a coil that induces a magneticfield have rapidly increased. For example, the electronic device mayperform magnetic secure transmission (MST). The electronic device mayapply a current to an embedded coil and the coil may induce an inducedmagnetic field based on the current applied to the coil. In this case,the electronic device may control the current applied to the coil andthe induced magnetic field induced from the coil may vary depending onthe controlled current. In addition, a conventional point of sale (POS)terminal for payment of a magnetic credit card may acquire paymentinformation by detecting the change in the magnetic field throughswiping of the magnetic credit card. Accordingly, if the electronicdevice can generate the same magnetic field change as the magnetic fieldchange by the swiping of the magnetic credit card, the electronic devicecan perform the payment of the magnetic credit card. The conventionalelectronic device may generate an MST signal according to magneticcredit card information and apply a current corresponding to thegenerated MST signal to the coil. The coil may induce the changedmagnetic field corresponding to the swiping of the magnetic credit cardaccording to the applied current.

Also, the electronic device may perform wireless charging by using theembedded coil. The coil embedded into the electronic device may generatean induced current based on the magnetic field input from the outsideand, accordingly, perform the wireless charging. Alternatively, theelectronic device may apply the current to the coil and thus wirelesslycharge another electronic device by discharging the induced magneticfield.

As described above, the conventional electronic device may include thecoil for performing various operations such as the MST or the wirelesscharging.

For good performance of MST or wireless charging, an electronic deviceshould form a sufficiently large induced magnetic field. When theelectronic device forms a relatively small induced magnetic field, aninduced current induced by the electronic device in a receiving sidealso becomes small, so that a charging speed may decrease or gooddelivery of an MST signal may be difficult.

For the good performance of the MST or wireless charging, a coilincluded in the electronic device should have sufficient inductance.Magnetic flux by the coil may be a product of the inductance and thecurrent applied to the coil. Accordingly, as the inductance of the coilis larger, a relatively larger induced magnetic field may be formed forthe same current. That is, in order to form a sufficiently largemagnetic field, the electronic device should include a coil havingrelatively high inductance. In addition, the inductance of the coil maybe associated with the number of turns of the coil and a strength of themagnetic field induced by the coil may be also proportional to thenumber of turns of the coil. However, a small electronic device whichcan be carried has a difficulty in unlimitedly increasing the number ofturns of the coil.

Accordingly, it is required to develop a coil structure havingrelatively high inductance in the limited area.

SUMMARY

According to various aspects of the present disclosure, an electronicdevice including coils of a plurality of layers having relatively highinductance even in a limited mounting area may be provided.Particularly, the electronic device may include conductors that connectcoils disposed on different layers and the conductors induce magneticfields, so that a total strength of the magnetic fields induced from theelectronic device may increase. In particular, a direction of themagnetic field induced from the coils may be different from a directionof the magnetic field induced from the conductor and, accordingly, theelectronic device may induce magnetic fields in various directions andthus have the high degree of freedom in a disposition.

In accordance with an aspect of the present disclosure, a portablecommunication device is provided. The portable communication deviceincludes a housing including a rear cover; a battery disposed in thehousing; near field communication (NFC) circuitry; wireless chargingcircuitry; magnetic secure transmission (MST) circuitry; a flexibleprinted circuit board (FPCB) including a plurality of layerssubstantially parallel to each other, at least a portion of the FPCBbeing disposed between the battery and the rear cover; an NFC coilelectrically connected with the NFC circuitry, the NFC coil including afirst portion formed with respect to one of the plurality of layers ofthe FPCB and a second portion formed with respect to another one of theplurality of layers of the FPCB; a wireless charging coil electricallyconnected with the wireless charging circuitry, the wireless chargingcoil including a third portion formed with respect to one of theplurality of layers of the FPCB and a fourth portion formed with respectto another one of the plurality of layers of the FPCB; and an MST coilelectrically connected with the MST circuitry, the MST coil including afifth portion formed with respect to one of the plurality of layers ofthe FPCB and a sixth portion formed with respect to another one of theplurality of layers of the FPCB. When viewed in a directionsubstantially perpendicular to a rear surface of the portablecommunication device, the first portion is at least partially surroundedby the fifth portion and the third portion is located between the firstportion and the fifth portion. When viewed in the directionsubstantially perpendicular to the rear surface of the portablecommunication device, the second portion is at least partiallysurrounded by the sixth portion and the fourth portion is locatedbetween the second portion and the sixth portion. The sixth portion isformed as an opened loop with a region unoccupied by the MST coilbetween an inside of the opened loop and an outside of the opened loop,and the second portion is connected with the NFC circuitry via aconductor disposed through the region.

In accordance with another aspect of the present disclosure, a portablecommunication device is provided. The portable communication deviceincludes near field communication (NFC) circuitry; wireless chargingcircuitry; magnetic secure transmission (MST) circuitry; a flexibleprinted circuit board (FPCB) including a first substrate layer and asecond substrate layer; an NFC coil electrically connected with the NFCcircuitry, the NFC coil including a first portion formed on the firstsubstrate layer and a second portion formed on the second substratelayer; a wireless charging coil electrically connected with the wirelesscharging circuitry, the wireless charging coil including a third portionformed on the first substrate layer and a fourth portion formed on thesecond substrate layer; and an MST coil electrically connected with theMST circuitry, the MST coil including a fifth portion formed on thefirst substrate layer and a sixth portion formed on the second substratelayer. The first portion is at least partially surrounded by the fifthportion and the third portion is located between the first portion andthe fifth portion. The second portion is at least partially surroundedby the sixth portion and the fourth portion is located between thesecond portion and the sixth portion. The sixth portion is formed as anopened loop with a region unoccupied by the MST coil between an insideof the opened loop and an outside of the opened loop, and the secondportion is connected with the NFC circuitry via a conductor disposedthrough the region.

In accordance with another aspect of the present disclosure, a portablecommunication device is provided. The portable communication deviceincludes near field communication (NFC) circuitry; wireless chargingcircuitry; magnetic secure transmission (MST) circuitry; a flexibleprinted circuit board (FPCB) including a first substrate layer and asecond substrate layer; an NFC coil electrically connected with the NFCcircuitry, the NFC coil including a first portion formed on the firstsubstrate layer and a second portion formed on the second substratelayer, wherein at least part of the first portion is connected to atleast part of the second portion through at least one first conductorformed through the FPCB; a wireless charging coil electrically connectedwith the wireless charging circuitry, the wireless charging coilincluding a third portion formed on the first substrate layer and afourth portion formed on the second substrate layer, wherein at leastpart of the third portion is connected to at least part of the fourthportion through at least one second conductor formed through the FPCB;an MST coil electrically connected with the MST circuitry, the MST coilincluding a fifth portion formed on the first substrate layer and asixth portion formed on the second substrate layer, wherein at leastpart of the fifth portion is connected to at least part of the sixthportion through at least one third conductor formed through the FPCB; atleast one fourth conductor connecting the NFC coil to the NFC circuitry,wherein at least part of the at least one fourth conductor is connectedto at least part of the NFC coil through at least one fifth conductorformed through the FPCB; and at least one sixth conductor connecting thewireless charging coil to the wireless charging circuitry, wherein atleast part of the at least one sixth conductor is connected to at leastpart of the wireless charging coil through at least one seventhconductor formed through the FPCB.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram of an electronic device and a networkaccording to various embodiments of the present disclosure;

FIG. 2 is a block diagram of an electronic device according to variousembodiments of the present disclosure;

FIG. 3 is a diagram illustrating MST according to various embodiments ofthe present disclosure;

FIG. 4 is a flowchart illustrating an operation of the electronic deviceaccording to various embodiments of the present disclosure;

FIG. 5 is a diagram of a coil according to various embodiments of thepresent disclosure;

FIG. 6A is a plan view illustrating a coil disposed on a first boardaccording to various embodiments of the present disclosure;

FIG. 6B is a plan view illustrating a coil disposed on a second boardaccording to various embodiments of the present disclosure;

FIG. 6C is a plan view illustrating coils disposed on a first board anda second board while overlapping each other;

FIG. 7 is a plan view illustrating locations of conductors according tovarious embodiments of the present disclosure;

FIGS. 8A and 8B are diagrams illustrating an increase in the degree offreedom of the disposition of the electronic device according to variousembodiments of the present disclosure;

FIG. 9A is a plan view illustrating a coil disposed on a second boardaccording to various embodiments of the present disclosure;

FIG. 9B is a perspective view illustrating a structure in which anadditional coil is disposed according to various embodiments of thepresent disclosure;

FIG. 10A is a plan view illustrating a first layer on which a pluralityof coils are disposed according to various embodiments of the presentdisclosure;

FIG. 10B is a plan view illustrating a second layer on which a pluralityof coils are disposed according to various embodiments of the presentdisclosure;

FIG. 10C is a plan view illustrating overlapping of the first layerstructure of FIG. 10A and the second layer structure of FIG. 10B;

FIGS. 11A to 11C are diagrams illustrating a connection relation inconnection parts of coils according to various embodiments of thepresent disclosure;

FIGS. 12A and 12B illustrate a coil structure according to variousembodiments of the present disclosure;

FIG. 13 is a graph of an MST signal recognition success rate accordingto various embodiments of the present disclosure;

FIGS. 14A to 14F illustrate a coil in a three layered structureaccording to various embodiments of the present disclosure;

FIG. 15A illustrates a result of recognized area;

FIG. 15B illustrates a recognition success rate of the coils in the twolayered structure and the coils in the three layered structure accordingto the present disclosure;

FIGS. 16A and 16B illustrate coils disposed on a wearable electronicdevice;

FIGS. 17A to 17C illustrate coils in a three layered structure accordingto various embodiments of the present disclosure;

FIGS. 18A and 18B illustrate results of recognized area according tovarious embodiments;

FIGS. 19 and 20 illustrate circular coils in various two layered andthree layered structures according to various embodiments of the presentdisclosure;

FIG. 21 is a block diagram of an electronic device according to variousembodiments of the present disclosure;

FIG. 22 is a rear perspective view of an electronic device when a caseof the electronic device is opened according to various embodiments ofthe present disclosure;

FIG. 23 is a cross-sectional view of an electronic device according tovarious embodiments of the present disclosure;

FIGS. 24A and 24B illustrate laminated structures of FPCBs on whichcoils in a two layered structure and coils in a three layered structureare disposed according to various embodiments of the present disclosure;and

FIG. 25 is a plan view illustrating a coil pattern according to variousembodiments of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT DISCLOSURE

Hereinafter, various embodiments of the present disclosure will bedescribed with reference to the accompanying drawings. However, itshould be understood that there is no intent to limit the presentdisclosure to the particular forms disclosed herein; rather, the presentdisclosure should be construed to cover various modifications,equivalents, and/or alternatives of embodiments of the presentdisclosure. In describing the drawings, similar reference numerals maybe used to designate similar constituent elements.

As used herein, the expressions “have”, “may have”, “include”, or “mayinclude” refer to the existence of a corresponding feature (e.g.,numeral, function, operation, or constituent element such as component),and do not exclude one or more additional features.

In the present disclosure, the expressions “A or B”, “at least one of Aor/and B”, or “one or more of A or/and B” may include all possiblecombinations of the items listed. For example, the expressions “A or B”,“at least one of A and B”, or “at least one of A or B” refer to all of(1) including at least one A, (2) including at least one B, or (3)including all of at least one A and at least one B.

The expressions “a first”, “a second”, “the first”, or “the second” usedin various embodiments of the present disclosure may modify variouscomponents regardless of the order and/or the importance but do notlimit the corresponding components. For example, a first user device anda second user device indicate different user devices although both ofthem are user devices. For example, a first element may be referred toas a second element, and similarly, a second element may be referred toas a first element without departing from the scope of the presentdisclosure.

It should be understood that when an element (e.g., first element) isreferred to as being (operatively or communicatively) “connected,” or“coupled,” to another element (e.g., second element), it may be directlyconnected or coupled directly to the other element or any other element(e.g., third element) may be interposed between them. In contrast, itmay be understood that when an element (e.g., first element) is referredto as being “directly connected,” or “directly coupled” to anotherelement (second element), there are no element (e.g., third element)interposed between them.

The expression “configured to” used in the present disclosure may beused interchangeably with, for example, “suitable for”, “having thecapacity to”, “designed to”, “adapted to”, “made to”, or “capable of”according to the situation. The term “configured to” may not necessarilyimply “specifically designed to” in hardware. Alternatively, in somesituations, the expression “device configured to” may mean that thedevice, together with other devices or components, “is able to”. Forexample, the phrase “processor adapted (or configured) to perform A, B,and C” may indicate a dedicated processor (e.g. embedded processor) onlyfor performing the corresponding operations or a generic-purposeprocessor (e.g., central processing unit (CPU) or application processor(AP)) that can perform the corresponding operations by executing one ormore software programs stored in a memory device.

The terms used herein are merely for the purpose of describingparticular embodiments and are not intended to limit the scope of otherembodiments. As used herein, singular forms may include plural forms aswell unless the context clearly indicates otherwise. Unless definedotherwise, all terms used herein have the same meaning as those commonlyunderstood by a person skilled in the art to which the presentdisclosure pertains. Such terms as those defined in a generally useddictionary may be interpreted to have the same meanings as thecontextual meanings in the relevant field of art, and are not to beinterpreted to have ideal or excessively formal meanings unless clearlydefined in the present disclosure. In some cases, even terms defined inthe present disclosure should not be interpreted to exclude embodimentsof the present disclosure.

An electronic device according to various embodiments of the presentdisclosure may include at least one of, for example, a smart phone, atablet personal computer (PC), a mobile phone, a video phone, anelectronic book reader (e-book reader), a desktop PC, a laptop PC, anetbook computer, a workstation, a server, a personal digital assistant(PDA), a portable multimedia player (PMP), a moving picture expertsgroup (MPEG-1) audio layer-3 (MP3) player, a mobile medical device, acamera, and a wearable device. According to various embodiments, thewearable device may include at least one of an accessory type (e.g., awatch, a ring, a bracelet, an anklet, a necklace, a glasses, a contactlens, or a head mounted device (HMD)), a fabric or clothing integratedtype (e.g., an electronic clothing), a body-mounted type (e.g., a skinpad, or tattoo), and a bio-implantable type (e.g., an implantablecircuit). In addition, the electronic device may wirelessly receivepower from a wireless power transmitter and thus may be called wirelesspower receiver.

According to some embodiments, the electronic device may be a homeappliance. The home appliance may include at least one of, for example,a television, a digital video disk (DVD) player, an audio, arefrigerator, an air conditioner, a vacuum cleaner, an oven, a microwaveoven, a washing machine, an air cleaner, a set-top box, a homeautomation control panel, a security control panel, a TV box (e.g.,Samsung HomeSync®, Apple TV®, or Google TV™), a game console (e.g.,Xbox® and PlayStation®), an electronic dictionary, an electronic key, acamcorder, and an electronic photo frame.

According to another embodiment, the electronic device may include atleast one of various medical devices (e.g., various portable medicalmeasuring devices (a blood glucose monitoring device, a heart ratemonitoring device, a blood pressure measuring device, a body temperaturemeasuring device, etc.), a magnetic resonance angiography (MRA), amagnetic resonance imaging (MRI), a computed tomography (CT) machine,and an ultrasonic machine), a navigation device, a global positioningsystem (GPS) receiver, an event data recorder (EDR), a flight datarecorder (FDR), a vehicle infotainment devices, an electronic devicesfor a ship (e.g., a navigation device for a ship, and a gyro-compass),avionics, security devices, an automotive head unit, a robot for home orindustry, an automated teller machine (ATM) in banks, point of sale(POS) device in a shop, or Internet of Things (IoT) device (e.g., alightbulb, various sensors, electric or gas meter, a sprinkler device, afire alarm, a thermostat, a streetlamp, a toaster, a sporting goods, ahot water tank, a heater, a boiler, etc.).

According to some embodiments, the electronic device may include atleast one of a part of furniture or a building/structure, an electronicboard, an electronic signature receiving device, a projector, andvarious kinds of measuring instruments (e.g., a water meter, an electricmeter, a gas meter, and a radio wave meter). The electronic deviceaccording to various embodiments of the present disclosure may be acombination of one or more of the aforementioned various devices.According to some embodiments, the electronic device may also be aflexible device. Further, the electronic device according to anembodiment of the present disclosure is not limited to theaforementioned devices, and may include a new electronic deviceaccording to the development of new technology.

Hereinafter, an electronic device according to various embodiments willbe described with reference to the accompanying drawings. In the presentdisclosure, the term “user” may indicate a person using an electronicdevice or a device (e.g. an artificial intelligence electronic device)using an electronic device.

FIG. 1 is a block diagram of an electronic device 101 within a networkenvironment 100, according to various embodiments.

Referring to FIG. 1, the electronic device 101 may include a bus 110, aprocessor 120, a memory 130, an input/output interface 150, a display160, a communication module 170, a wireless charging module 180, and anMST module 190. According to some embodiments, the electronic device 101may omit at least one of the above elements or may further include otherelements.

The bus 110 may include, for example, a circuit which interconnects theelements 110 to 190 and delivers communication (for example, a controlmessage and/or data) between the elements 110 to 190.

The processor 120 may include one or more of a central processing unit(CPU), an application processor (AP), and a communication processor(CP). For example, the processor 120 may carry out operations or dataprocessing relating to control and/or communication of at least oneother element of the electronic device 101.

The memory 130 may include a volatile memory and/or a non-volatilememory. The memory 130 may store, for example, instructions or datarelated to at least one other element of the electronic device 101.According to an embodiment, the memory 130 may store software and/or aprogram 140. The program 140 may include a kernel 141, middleware 143,an application programming interface (API) 145, and/or applicationprograms (or “applications”) 147. At least some of the kernel 141, themiddleware 143, and the API 145 may be referred to as an operatingsystem (OS).

The kernel 141 may control or manage, for example, system resources (forexample, the bus 110, the processor 120, and the memory 130) which areused to execute an operation or a function implemented in the otherprograms (for example, the middleware 143, the API 145, or theapplication programs 147). Furthermore, the kernel 141 may provide aninterface through which the middleware 143, the API 145, or theapplication programs 147 may access the individual elements of theelectronic device 101 to control or manage the system resources.

The middleware 143 may serve, for example, as an intermediary forallowing the API 145 or the application programs 147 to communicate withthe kernel 141 to exchange data.

In addition, the middleware 143 may process one or more task requestsreceived from the application programs 147 according to prioritiesthereof. For example, the middleware 143 may assign priorities for usingthe system resources (for example, the bus 110, the processor 120, thememory 130, or like) of the electronic device 101 to at least one of theapplication programs 147. For example, the middleware 143 may performscheduling or load balancing on the one or more task requests byprocessing the one or more task requests according to the prioritiesassigned thereto.

The API 145 is an interface through which the applications 147 controlfunctions provided from the kernel 141 or the middleware 143, and mayinclude, for example, at least one interface or function (for example,instruction) for file control, window control, image processing, or textcontrol.

The input/output interface 150 may function as, for example, aninterface that may transfer instructions or data input from a user oranother external device to the other element(s) of the electronic device101. Furthermore, the input/output interface 150 may output theinstructions or data received from the other element(s) of theelectronic device 101 to the user or another external device.

The display 160 may include, for example, a liquid crystal display(LCD), a light emitting diode (LED) display, an organic light emittingdiode (OLED) display, a microelectromechanical systems (MEMS) display,and an electronic paper display. The display 160 may display, forexample, various types of contents (for example, text, images, videos,icons, or symbols) to the user. The display 160 may include a touchscreen and receive, for example, a touch, gesture, proximity, orhovering input by using an electronic pen or the user's body part.

The communication module 170 may set, for example, communication betweenthe electronic device 101 and a first external electronic device 102, asecond external electronic device 104, or a server 106. For example, thecommunication module 170 may be connected to a network 162 throughwireless or wired communication to communicate with the second externalelectronic device 104 or the server 106.

The wireless communication may use at least one of, for example, longterm evolution (LTE), LTE-advance (LTE-A), code division multiple access(CDMA), wideband CDMA (WCDMA), universal mobile telecommunicationssystem (UMTS), wireless broadband (WiBro), and Global system for mobilecommunications (GSM), as a cellular communication protocol. In addition,the wireless communication may include, for example, short rangecommunication 164. The short-range communication 164 may be performed byusing at least one of, for example, Wi-Fi, Bluetooth, near fieldcommunication (NFC), and global navigation satellite system (GNSS). TheGNSS may include at least one of, for example, a global positioningsystem (GPS), a global navigation satellite system (Glonass), a Beidounavigation satellite system (hereinafter “Beidou”), and a Europeanglobal satellite based navigation system (Galileo), according to a usearea, a bandwidth, or the like. “GPS” may be interchangeably used withthe “GNSS”. The wired communication may include at least one of, forexample, a universal serial bus (USB), a high definition multimediainterface (HDMI), recommended standard 232 (RS-232), and a plain oldtelephone service (POTS). The network 162 may include at least one of acommunication network such as a computer network (for example, a localarea network (LAN) or a wide area network (WAN)), the Internet, and atelephone network.

The wireless charging module 180 may receive wireless power from awireless power receiver or transmit wireless power to another electronicdevice. The wireless charging module 180 may receive or transmitwireless power based on an induction scheme or a resonance scheme. Thewireless charging module 180 may include a coil fortransmitting/receiving wireless power.

The MST module 190 may perform MST with another electronic device. Theperformance of the MST may mean formation of a magnetic field 191 thatchanges the size according to time. For example, the MST module 190 mayinduce the magnetic field 191 that changes size according to time, andthe change in size according to time may be equal to transmission of asignal including information. Another electronic device, for example, aPOS terminal may receive a signal including information from theelectronic device 101 by detecting the change in the size of themagnetic field 191 according to time. In addition, the MST module 190may include a coil for discharging a magnetic field. The MST module 190may receive a signal from another electronic device by detecting thechange in the magnetic field received from the other electronic deviceaccording to time.

Each of the first and second external electronic apparatuses 102 and 104may be of a type identical to or different from that of the electronicapparatus 101. According to an embodiment, the server 106 may include agroup of one or more servers. According to various embodiments of thepresent disclosure, all or some of the operations performed in theelectronic device 101 may be performed in another electronic device or aplurality of electronic devices 102 and 104, or the server 106.According to an embodiment, when the electronic device 101 has toperform some functions or services automatically or in response to arequest, the electronic device 101 may make a request for performing atleast some functions relating thereto to another electronic device 102or 104 or the server 106 instead of performing the functions or servicesby itself or in addition. Another electronic device 102 or 104 or theserver 106 may execute the requested functions or the additionalfunctions, and may deliver a result of the execution to the electronicapparatus 101. The electronic device 101 may provide the received resultas it is or additionally process the result and provide the requestedfunctions or services. To achieve this, for example, cloud computing,distributed computing, or client-server computing technology may beused.

FIG. 2 is a block diagram of an electronic device 201 according tovarious embodiments.

Referring to FIG. 2, the electronic device 201 may include, for example,all or some of the electronic device 101 illustrated in FIG. 1. Theelectronic device 201 may include one or more processors 210 (forexample, an AP), a communication module 220, an MST module 222, asubscriber identification module 224, a memory 230, a sensor module 240,an input device 250, a display 260, an interface 270, an audio module280, a camera module 291, a power management module 295, a battery 296,an indicator 297, a motor 298, and a wireless charging module 299.

The processor 210 may control a plurality of hardware or softwareelements connected to the processor 210 by driving an operating systemor an application program and perform processing of various pieces ofdata and calculations. The processor 210 may be implemented by, forexample, a system on chip (SoC). According to an embodiment, theprocessor 210 may further include a graphics processing unit (GPU)and/or an image signal processor. The processor 210 may also include atleast some (for example, a cellular module 221) of the elementsillustrated in FIG. 2. The processor 210 may load, into a volatilememory, instructions or data received from at least one (for example, anon-volatile memory) of the other elements and may process the loadedinstructions or data, and may store various data in a non-volatilememory.

The communication module 220 may have a configuration equal or similarto that of the communication interface 170 of FIG. 1. The communicationmodule 220 may include, for example, a cellular module 221, a Wi-Fimodule 223, a Bluetooth (BT) module 225, a GNSS module 227 (for example,a GPS module, a Glonass module, a Beidou module, or a Galileo module),an NFC module 228, and a radio frequency (RF) module 229.

The cellular module 221 may provide a voice call, an image call, a textmessage service, or an Internet service through, for example, acommunication network. According to an embodiment, the cellular module221 may distinguish between and authenticate electronic devices 201within a communication network using a subscriber identification module(SIM) card 224. The cellular module 221 may perform at least some of thefunctions that the processor 210 may provide. The cellular module 221may include a CP.

The Wi-Fi module 223, the Bluetooth module 225, the GNSS module 227, orthe NFC module 228 may include, for example, a processor that processesdata transmitted and received through the corresponding module.According to some embodiments, at least some (two or more) of thecellular module 221, the Wi-Fi module 223, the BT module 225, the GNSSmodule 227, and the NFC module 228 may be included in one integratedcircuit (IC) or IC package.

The RF module 229 may transmit/receive, for example, a communicationsignal (for example, an RF signal). The RF module 229 may include, forexample, a transceiver, a power amplifier module (PAM), a frequencyfilter, a low noise amplifier (LNA), or an antenna. According to anotherembodiment of the present disclosure, at least one of the cellularmodule 221, the Wi-Fi module 223, the BT module 225, the GNSS module227, and the NFC module 228 may transmit/receive an RF signal through aseparate RF module.

The subscriber identification module 224 may include, for example, acard including a subscriber identity module and/or an embedded SIM, andmay contain unique identification information (for example, anintegrated circuit card identifier (ICCID)) or subscriber information(for example, an international mobile subscriber identity (IMSI)).

The MST module 222 may transmit/receive a signal using a magnetic field,for example, a signal including information such as payment information.The MST module 222 may induce the magnetic field that changes the sizeaccording to time and perform communication based on an induced currentfrom the received magnetic field.

The memory 230 (for example, the memory 130) may include, for example,an internal memory 232 or an external memory 234. The internal memory232 may include at least one of a volatile memory (for example, adynamic random access memory (DRAM), a static RAM (SRAM), a synchronousDRAM (SDRAM), and the like) and a non-volatile memory (for example, aone-time programmable read only memory (OTPROM), a programmable ROM(PROM), an erasable PROM (EPROM), an electrically erasable PROM(EEPROM), a mask ROM, a flash ROM, a flash memory (for example, a NANDflash memory or a NOR flash memory), a hard disk drive, a solid statedrive (SSD), and the like).

The external memory 234 may further include a flash drive, for example,a compact flash (CF), a secure digital (SD) device, a micro SD(Micro-SD) device, a mini SD (Mini-SD) device, an eXtreme digital (xD)device, a memory stick, or the like. The external memory 234 may befunctionally and/or physically connected to the electronic device 201through various interfaces.

The sensor module 240 may measure a physical quantity or detect anoperation state of the electronic device 201, and may convert themeasured or detected information into an electrical signal. The sensormodule 240 may include, for example, at least one of a gesture sensor240A, a gyro sensor 240B, an atmospheric pressure sensor 240C, amagnetic sensor 240D, an acceleration sensor 240E, a grip sensor 240F, aproximity sensor 240G, a color sensor 240H (for example, a red, green,blue (RGB) sensor), a biometric sensor 240I, a temperature/humiditysensor 240J, an illumination sensor 240K, and a ultraviolet (UV) lightsensor 240M. Additionally or alternatively, the sensor module 240 mayinclude, for example, an electronic nose (E-nose) sensor, anelectromyography (EMG) sensor, an electroencephalogram (EEG) sensor, anelectrocardiogram (ECG) sensor, an infrared (IR) sensor, an iris sensor,and/or a fingerprint sensor. The sensor module 240 may further include acontrol circuit for controlling one or more sensors included therein.According to some embodiments, the electronic device 201 may furtherinclude a processor configured to control the sensor module 240 as apart of or separately from the processor 210, and may control the sensormodule 240 while the processor 210 is in a sleep state.

The input device 250 may include, for example, a touch panel 252, a(digital) pen sensor 254, a key 256, and an ultrasonic input device 258.The touch panel 252 may use at least one of, for example, a capacitivetype, a resistive type, an infrared type, and an ultrasonic type. Also,the touch panel 252 may further include a control circuit. The touchpanel 252 may further include a tactile layer and provide a tactilereaction to the user.

The (digital) pen sensor 254 may include, for example, a recognitionsheet which is a part of the touch panel or is separated from the touchpanel. The key 256 may include, for example, a physical button, anoptical key or a keypad. The ultrasonic input device 258 may detectultrasonic waves generated by an input tool through a microphone 288 andidentify data corresponding to the detected ultrasonic waves.

The display 260 (for example, the display 160) may include a panel 262,a hologram device 264 or a projector 266. The panel 262 may include aconfiguration identical or similar to that of the display 160illustrated in FIG. 1. The panel 262 may be implemented to be, forexample, flexible, transparent, or wearable. The panel 262 and the touchpanel 252 may be implemented as one module. According to an embodiment,the panel 262 may include a pressure sensor (or a POS sensor) which maymeasure a strength of pressure of a user's touch. The pressure sensormay be implemented integratedly with the touch panel 252 or implementedby one or more sensors separated from the touch panel 252. The hologramdevice 264 may show a three dimensional image in the air by using aninterference of light. The projector 266 may display an image byprojecting light onto a screen. The screen may be located, for example,inside or outside the electronic device 201. According to an embodiment,the display 260 may further include a control circuit for controllingthe panel 262, the hologram device 264, or the projector 266.

The interface 270 may include, for example, a HDMI 272, a USB 274, anoptical interface 276, or a D-subminiature (D-sub) connector 278. Theinterface 270 may be included in, for example, the communicationinterface 170 illustrated in FIG. 1. Additionally or alternatively, theinterface 270 may include, for example, a mobile high definition link(MHL) interface, an SD card/multimedia card (MMC) interface, or anInfrared Data Association (IrDA) standard interface.

The audio module 280 may bilaterally convert, for example, a sound andan electrical signal. At least some elements of the audio module 280 maybe included in, for example, the input/output interface 150 illustratedin FIG. 1. The audio module 280 may process sound information which isinput or output through, for example, a speaker 282, a receiver 284,earphones 286, the microphone 288 or the like.

The camera module 291 is a device which may photograph a still image anda dynamic image. According to an embodiment, the camera module 291 mayinclude one or more image sensors (for example, a front sensor or a backsensor), a lens, an image signal processor (ISP) or a flash (forexample, LED or xenon lamp).

The power management module 295 may manage, for example, power of theelectronic device 201. According to an embodiment, the power managementmodule 295 may include a power management IC (PMIC), a charger IC, or abattery gauge. The PMIC may have a wired and/or wireless chargingscheme. Examples of the wireless charging method may include, forexample, a magnetic resonance method, a magnetic induction method, anelectromagnetic wave method, and the like, and may further includeadditional circuits (for example, a coil loop, a resonance circuit, arectifier, etc.) for wireless charging. The battery gauge may measure,for example, a residual quantity of the battery 296, and a voltage, acurrent, or a temperature during the charging. The battery 296 mayinclude, for example, a rechargeable battery or a solar battery. Thepower management module 295 may be connected to the wireless chargingmodule 299. The wireless charging module 299 may receive wireless powerfrom another electronic device and charge the battery 296.Alternatively, the wireless charging module 299 may wirelessly chargeanother electronic device by using power from the battery 296. Thewireless charging module 299 may be directly connected to the battery296.

The indicator 297 may indicate a particular state (for example, abooting state, a message state, a charging state, or the like) of theelectronic device 201 or a part (for example, the processor 210) of theelectronic device 201. The motor 298 may convert an electrical signalinto mechanical vibration, and may generate vibration, a haptic effect,or the like. Although not illustrated, the electronic device 201 mayinclude a processing unit (for example, a GPU) for supporting a mobiletelevision (TV). The processing unit for supporting mobile TV may, forexample, process media data according to a certain standard such asdigital multimedia broadcasting (DMB), digital video broadcasting (DVB),or mediaFlo™.

Each of the above-described component elements of hardware according tothe present disclosure may be configured with one or more components,and the names of the corresponding component elements may vary based onthe type of electronic device. The electronic device according tovarious embodiments of the present disclosure may include at least oneof the aforementioned elements. Some elements may be omitted or otheradditional elements may be further included in the electronic device.Also, some of the hardware components according to various embodimentsmay be combined into one entity, which may perform functions identicalto those of the relevant components before the combination.

FIG. 3 is a diagram illustrating MST according to various embodiments ofthe present disclosure.

Referring to FIG. 3, a POS terminal 301 may be a device, which mayacquire payment information from a magnetic credit card and transmit theacquired information to a payment server. For example, a reader headerof the POS terminal 301 may sense a magnetic field when a magneticrecording medium such as a magnetic stripe of the credit card contactsthe reader header. When the magnetic credit card is swiped through thereader header, the magnetic field sensed by the POS terminal 301 may bechanged and the POS terminal 301 may acquire the changed magnetic fieldas payment information. That is, the POS terminal 301 may acquire themagnetic field changed according to time as the payment information.

The POS terminal 301 may transmit the payment information to the paymentserver, and the payment server may perform payment processing by usingthe received payment information. The POS terminal 301 may also transmitadditional information (for example, payment amount) input from an inputdevice to the payment server, and the payment server may determinewhether to approve the payment based on the received payment informationand the additional information. The payment server may transmitinformation on the approval of the payment or information on rejectionof the payment to the POS terminal 301, and the POS terminal 301 mayoutput the received information. That is, the POS terminal 301 may be arelay device for the payment information and the information on thepayment approval or rejection, and receive a change in the ambientmagnetic field as a signal.

In addition, the electronic device 101 according to various embodimentsof the present disclosure may induce a magnetic field 320. Theelectronic device 101 may include coils of a plurality of layersaccording to various embodiments of the present disclosure, and inducethe magnetic field 320 by applying the current to the coil. According tovarious embodiments of the present disclosure, the electronic device 101may display a payment application execution screen 310 on the display160. The payment application may include an image 312 related to apre-registered credit card and an object 311 indicating that the paymentis being performed. The electronic device 101 may change the magneticfield 320 according to time in accordance with the pre-registered creditcard and, accordingly, a change pattern of the magnetic field 320generated by the electronic device 101 may be the same as or correspondto a change pattern of the magnetic field by swiping of the credit card.That is, based on the fact that the magnetic field, which is changedaccording to the time, is formed, the discharging of the magnetic fieldfrom the electronic device 101 may have the same effect as the swipingof the credit card. Accordingly, the user may perform payment by usingthe electronic device 101 without a need to possess the credit card.

FIG. 4 is a flowchart illustrating an operation of the electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIG. 4, in operation 410, the electronic device 101 mayexecute the payment application. The payment application has nolimitation as long as the payment application is an application whichcan manage payment information related to the credit card and generatean MST signal. In operation 420, the electronic device 101 may performuser authentication. The electronic device 101 may output, for example,a graphic user interface which makes a request for inputting presetsecurity information. The security information may be biometricinformation such as a user's fingerprint, voice, and iris or informationon a password or pattern preset by the user, and has no limitation inthe type. The electronic device 101 may receive the requested securityinformation and compare the received security information withpre-stored security information, so as to perform user authentication.

In operation 430, the electronic device 101 may generate the MST signal.The MST signal may include payment information corresponding to thepre-registered credit card. In operation 440, the electronic device mayapply the current corresponding to the MST signal to an MST coil. TheMST coil may generate an induced magnetic field based on the appliedcurrent. The size of the induced magnetic field may be changed accordingto, for example, payment information corresponding to the credit card.The POS terminal may acquire payment information by sensing the inducedmagnetic field.

FIG. 5 is a diagram of the coil according to various embodiments of thepresent disclosure.

Referring to FIG. 5, a first coil 510 and a third coil 530 may bedisposed on a first layer. The third coil 530 may be adjacent to theouter side of the first coil 510, which means that a next coil disposedon the outer side of the first coil 510 is the third coil 530. A windingradius of the third coil 530 may be larger than a winding radius of thefirst coil 510. That is, the first coil 510 may be disposed relativelyon the inner side, and the third coil 530 may be disposed relatively onthe outer side compared to the first coil 510. The inner side or theouter side may be determined according to a distance between the coil510 or 530 and the center. As illustrated in FIG. 5, a distance betweenthe center of the coil and the first coil 510 may be shorter than adistance between the center of the coil and the third coil 530 and,accordingly, it may be defined that the first coil 510 is disposedrelatively inside compared to the third coil 530. In addition, two ormore coils may be disposed on the first layer. That is, additional coilsmay be further disposed on the outer side of the third coil 530. Thatis, a plurality of coils (for example, the first coil 510 and the thirdcoil 530) may be disposed on the first layer. The plurality of coils mayperform one operation (for example, discharging the magnetic field forMST). The plurality of coils may be connected to each other through aconductor and a plurality of coils on a second layer. A plurality ofadditional coils for another operation (for example, wireless chargingor NFC) may be further disposed on the first layer, which will bedescribed below in more detail. In this case, the plurality of coils andthe plurality of additional coils may not be directly connected to eachother.

The first coil 510 may include a conductor connected from a start point511 to an end point 512, and the conductor may have a winding form.Although it is illustrated that the conductor included in the first coil510 has the winding form bent at a right angle in an embodiment of FIG.5, this is only an example, and the first coil 510 has no limitation ifthe coil is a conductor which can induce an induced magnetic field in aparticular direction. The start point 511 of the first coil 510 may beformed substantially more inwardly than the end point 512 of the firstcoil 510. The inner side may refer to a side relatively closer to thecenter of the first coil 510. A current i may be applied to the firstcoil 510, and the first coil 510 may induce the induced magnetic fieldaccording to the applied current i. In addition, the current i of thesame direction as that of the first coil 510 may be applied to the thirdcoil 530, and the third coil 530 may also induce the induced magneticfield. The magnetic field induced from the first coil 510 and the thirdcoil 530 may be named a first magnetic field B1.

The first coil 510 may have a closed loop form. More specifically, asecond connection part 514 connected with the end point 512 of the firstcoil 510 may have a form extended to the right side as viewed from thetop. The second connection part 514 may extend to the right side whilepassing through an x direction coordinate of the start point 511 of thefirst coil 510 and, accordingly, the start point 511 of the first coil510 may be isolated from the outside by the second connection part 514.As described above, the form in which the start point of the coil isclosed from the outside by the connection part connected to the endpoint may be named the closed loop form. That is, in the closed loopform, an x axis coordinate of the end point 512 of the first coil 510may be disposed on the right side of an x axis coordinate of the startpoint 511 of the first coil 510. In addition, a first connection part513 and the second connection part 514 of the first coil 510 may beparts for a connection with the conductor, that is, a via set, and theremaining parts except for the connection parts 513 and 514 may be partsfor the winding. Accordingly, the remaining parts except for theconnection parts of the coil may be named a winding pattern.

The first coil 510 may generally have a width of d1. In addition, thefirst connection part 513 connected to the start point 511 of the firstcoil 510 may generally have a width of d2 and, accordingly, some of thefirst connection part 513 may have a form in which a width is reducedfrom d1 to d2. As the width d2 of the first connection part 513 isnarrower than the general width d1 of the first coil 510, it is possibleto secure a space to dispose a plurality of conductors 561 to 564 andalso reduce a total mounting areas of the coils 510 and 530 disposed onthe first layer. For example, if the first connection part 513 has thewidth d1, a width of the corresponding part becomes larger than 2×d1 inconsideration of separation between the first connection part 513 andthe second connection part 514. However, since the first connection part513 has a structure in which the width is reduced, a total coil width ofthe part where the first connection part 513 and the second connectionpart 514 are disposed may be about d1. More specifically, a sum of thefirst connection part 513 and the second connection part 514 may besmaller than d1. Accordingly, it is possible to prevent the mountingarea of the coil in which the start point and the end point of the coilare located from being wide.

According to various embodiments of the present disclosure, thestructure in which the width of the first connection part 513 becomesnarrow and the structure in which the width of the second connectionpart 514 becomes narrow may correspond to each other. More specifically,the first connection part 513 may have the structure in which the widthbecomes narrower in an upper left direction as viewed from the top andthe second connection part 514 may have the structure in which the widthbecomes narrower in a lower right direction as viewed from the top. Thatis, the first connection part 513 may have a form in which the widthincreases in a first side direction of the winding pattern from thestart point 511, and the second connection part 514 may have a form inwhich the width increases in a second side direction of the windingpattern from the end point 512, which may be also applied to theremaining coils. Accordingly, the first connection part 513 and thesecond connection part 514 may be disposed together within the width d1.More specifically, a sum of the width d2 of the first connection part513 and the width d2 of the second connection part 514 may be smallerthan the width d1 of the winding pattern of the first coil 510.

The end point 512 of the first coil 510 may be connected to the firstconductor 561. For example, the first conductor 561 may be formed in adirection substantially perpendicular to the first layer on which thefirst coil 510 is disposed. The first conductor 561 may be connected toa start point 521 of a second coil 520. That is, the first conductor 561may connect the end point 512 of the first coil 510 and the start point521 of the second coil 520 and apply the current i from the end point512 of the first coil 510 to the start point 521 of the second coil 520.The first conductor 561 may extend in a direction substantiallyperpendicular to the first layer on which the first coil 510 is disposedand the second layer on which the second coil 520 is disposed. Anotherelement may be disposed between the first layer and the second layerand, in this case, the first conductor 561 may connect the two coils 510and 520 through an opening formed on the other element disposedtherebetween. In this case, the first conductor 561 may be named a viaset. According to various embodiments of the present disclosure, oneconductor of FIG. 5 may be implemented by a plurality of separatedconductors. That is, a plurality of separated conductors may connect theend point 512 of the first coil 510 and the start point 521 of thesecond coil 520 in a vertical direction. As a result, the number ofconductors for connecting the end point of the coil on the first layerand the start point of the coil on the second layer may be one or moreand, accordingly, the conductors may be named as the via set.

In addition, disposing on the first layer and the second layer may referto disposing two PCBs or two flexible PCBs (FPCBs), respectively.Alternatively, the first coil 510 and the second coil 520 may bedisposed on both surfaces of one PCB or FPCB, respectively. In thiscase, a structure in which the conductors, that is, the via set passesthrough one PCB or FPCB may appear. In this case, the first coil 510 maybe disposed on the first layer and the second coil 520 may be disposedon the second layer. Alternatively, coils of two layers may be disposedon the inner side of the FPCB and a plating layer or a film forprotecting the corresponding coil may be additionally included in theFPCB, which will be described below in more detail. Further, the firstlayer and the second layer may be substantially parallel to each other.

The second coil 520 may receive the current i through the firstconductor 561. In this case, the current i may be applied in a directionfrom a start point 521 of the second coil 520 to an end point 522 of thesecond coil 520 and may be applied to the second conductor 562 connectedto the end point 522. The second coil 520 may induce the inducedmagnetic field based on the applied current i. The induced magneticfield induced from the second coil 520 and a fourth coil 540 may benamed as a second magnetic field B2.

The second coil 520 may include a conductor connected from the startpoint 521 to the end point 522, and the conductor may have a windingform from the start point 521 to the end point 522. The second coil 520may include a third connection part 523 connected to the start point 521and a fourth connection part 524 connected to the end point 522. Generalwidths of the third connection part 523 and the fourth connection part524 may be smaller than a general width of the second coil 520. Further,as described about the connection parts 513 and 514 of the first coil510, some of the connection parts 523 and 524 may have a form in whichthe width is reduced from the general width of the second coil 520, thatis, the width d1 of the winding pattern.

The second coil 520 may have an opened loop form, which is an open type.More specifically, the fourth connection part 524 connected with the endpoint 522 of the second coil 520 may have a form extended to the rightside as viewed from the top. The fourth connection part 524 may extendwithout passing through an x direction coordinate of the start point 521of the second coil 520 and, accordingly, the start point 521 of thesecond coil 520 may be isolated from the outside by the fourthconnection part 524. That is, the x axis coordinate of the end point 522of the second coil 520 may be located relatively on the left side of thex axis coordinate of the start point 521 of the second coil 520. Asdescribed above, the form in which the start point of the coil is notclosed from the outside by the connection part connected to the endpoint may be named the opened loop form. In addition, as the second coil520 has the opened loop form, another coil may be disposed on the innerside of the second coil 520 and an input/output pattern of the othercoil may be disposed on an interval of the opened loop of the secondcoil 520, which will be described below in more detail.

In addition, the end point 522 of the second coil 520 may be connectedto the second conductor 562. The second conductor 562 may be connectedto a start point 531 of the third coil 530 disposed on the first layer.Accordingly, the end point 522 of the second coil 520 may be connectedto the start point 531 of the third coil 530. As the current i isapplied from the end point 522 of the second coil 520 to the start point531 of the third coil 530, a direction of the current i applied to thesecond conductor 562 may be an up direction.

The third coil 530 may receive the current i through the secondconductor 562. In this case, the current i may be applied in a directionfrom the start point 531 of the third coil 530 to an end point 532 ofthe third coil 530 and may be applied to the third conductor 563connected to the end point 532. The third coil 530 may induce theinduced magnetic field based on the applied current i.

The third coil 530 may include a conductor connected from the startpoint 531 to the end point 532, and the conductor may have a windingform from the start point 531 to the end point 532. The third coil 530may include a fifth connection part 533 connected to the start point 531and a sixth connection part 534 connected to the end point 532. Generalwidths of the fifth connection part 533 and the sixth connection part534 may be smaller than the general width of the third coil 530.Further, as described in relation to the connection parts 513 and 514 ofthe first coil 510, some of the connection parts 533 and 534 may have aform in which the width is reduced from the general width d1 of thethird coil 530. The third coil 530 may have a closed loop form.

In addition, the end point 532 of the third coil 530 may be connected tothe third conductor 563. The third conductor 563 may be connected to astart point 541 of the fourth coil 540 disposed on the second layer.Accordingly, the end point 532 of the third coil 530 may be connected tothe start point 541 of the fourth coil 540. As the current i is appliedfrom the end point 532 of the third coil 530 to the start point 541 ofthe fourth coil 540, a direction of the current i applied to the thirdconductor 563 may be a down direction.

The fourth coil 540 may receive the current i through the thirdconductor 563. In this case, the current i may be applied in a directionfrom the start point 541 of the fourth coil 540 to an end point 542 ofthe fourth coil 540 and may be applied to an output terminal connectedto the end point 542. The fourth coil 540 may induce the inducedmagnetic field based on the applied current i.

The fourth coil 540 may include a conductor connected from the startpoint 541 to the end point 542, and the conductor may have a windingform from the start point 541 to the end point 542. The fourth coil 540may include a seventh connection part 543 connected to the start point541. A general width of the seventh connection part 543 may be smallerthan the general width of the fourth coil 540, that is, the width of thewinding pattern. Further, as described in relation to the connectionparts 513 and 514 of the first coil 510, some of the connection part 543may have a form in which the width is reduced from the general width d1of the fourth coil 540. The fourth coil 540 may have an opened loopform.

In addition, an input pattern 550 may be disposed on the second layer.The input pattern 550 may be connected to the fourth conductor 564 andthe fourth conductor 564 may be connected to the start point 511 of thefirst coil 510. The input pattern 550 may be connected to a means (forexample, an MST communication module, a communication module, a battery,or a PMIC), which can provide the current, and, accordingly, the currenti may be applied to the first coil 510 from the input pattern 550.

A direction of the current i applied to the fourth conductor 564 may bean up direction. As a result, an order of coils to which the current isapplied or a coil connection order may be C₁₁, C₂₁, C₁₂, C₂₂, C₁₃, C₂₃,. . . . In C_(ij), i may denote a layer and j may denote an order of thedisposition from the inner side. For example, C₂₁ may be a first coilfrom the inner side on the second layer, and C₃₂ may be a second coilfrom the inner side on the third layer.

According to the above described coil structure, the current i providedfrom the input pattern 550 may be applied to the first coil 510, thesecond coil 520, the third coil 530, and the fourth coil 540.Accordingly, the number of turns of the whole coil may increase and thusinductance of the coil may also increase. That is, four turns arepossible in a mounting area in which two turns are possible, so thatinductance of the coil may increase. As a result, the size of themagnetic field (B1+B2) induced by the coil may also increase. Further, amagnetic field B3 induced by the conductors 561 to 564 may be alsoformed and thus a strength of entire magnetic fields may increase.Particularly, as conductors having the same current direction aregrouped and disposed, the magnetic field B3 induced by the conductors561 to 564 may increase. In addition, a direction of a directionalmagnetic field induced by the conductor may be determined according to adisposition form (for example, a straight line) of conductors having thesame current direction. Accordingly, the disposition form of theconductors having the same current direction may be determined inconsideration of the direction of the directional magnetic field. Morespecifically, the conductors 562 and 564 to which the current in the updirection is applied may be disposed adjacent to each other, and theconductors 561 and 563 to which the current in the down direction aredisposed adjacent to each other. Further, the direction of the magneticfield B3 induced by the conductors 561 to 564 may be different from thedirection of the magnetic field (B1+B2) induced by the coils 510 to 540,so that the electronic device 101 may induce the magnetic fields invarious directions. Accordingly, the degree of freedom for thedisposition of the electronic device 101 may increase, which will bedescribed below in more detail.

FIG. 6A is a plan view illustrating the coil disposed on the first layeraccording to various embodiments of the present disclosure. FIG. 6B is aplan view illustrating the coil disposed on the second layer accordingto various embodiments of the present disclosure. FIG. 6C is a plan viewillustrating coils disposed on the first layer and the second layerwhile overlapping each other.

The first coil 510 and the third coil 530 may be disposed on the firstlayer. The third coil 530 may be adjacent to the outer side of the firstcoil 510. The first coil 510 and the third coil 530 may have the closedloop form. In addition, the second coil 520 and the fourth coil 540 maybe disposed on the second layer. The fourth coil 540 may be adjacent tothe outer side of the second coil 520. The second coil 520 and thefourth coil 540 may have the opened loop form. In addition, asillustrated in FIG. 6C, a part of the first coil 510 except for thefirst connection part 513 and the second connection part 514 and a partof the second coil 520 except for the third connection part 523 and thefourth connection part 524 may overlap each other. This indicates that alocation of the part of the first coil 510 except for the firstconnection part 513 and the second connection part 514 and a location ofthe part of the second coil 520 except for the third connection part 523and the fourth connection part 524, that is, locations of the windingpatterns are substantially the same. In addition, the disposition of thecoils described above is only an example, and the first coil 510 and thesecond coil 520 may be configured to not overlap each other. Accordingto various embodiments of the present disclosure, most parts of thethird coil 530 and the fourth coil 540 except for the connection parts,that is, the winding patterns may overlap each other.

The first connection part 513 of the first coil 510 and the secondconnection part 523 of the second coil 520 may not overlap each other.This is because the second connection part 514 of the first coil 510should extend up to the start point 521 of the second coil 520 since theend point 512 of the first coil 510 should be connected to the startpoint 521 of the second coil 520. According to various embodiments ofthe present disclosure, the parts of the first coil 510 and the secondcoil 520 except for the connection parts, that is, the winding patternsmay overlap each other, and the connection parts may not overlap.

In addition, as illustrated in FIG. 6C, the conductors 562 and 564 towhich the current in the up direction is applied may be disposedadjacent to each other, and the conductors 561 and 563 to which thecurrent in the down direction is applied are disposed adjacent to eachother.

FIG. 7 is a plan view illustrating locations of the conductors accordingto various embodiments of the present disclosure.

Referring to FIG. 7, a distance X1 between the second conductor 562 andthe fourth conductor 564 may be relatively smaller than a distance X2between the second conductor 562 and the first conductor 561 or adistance X3 between the second conductor 562 and the third conductor563. Further, a distance X4 between the first conductor 561 and thethird conductor 563 may be relatively smaller than the distance X2between the second conductor 562 and the first conductor 561 or thedistance X3 between the second conductor 562 and the third conductor563. That is, the pattern of the conductors 561 to 564 may be designedsuch that the conductors to which the current in the same direction isapplied are adjacent to each other. Accordingly, a direction of aninduced magnetic field B4 induced from the second conductor 562 and thefourth conductor 564 and a direction of an induced magnetic field B5induced from the first conductor 561 and the third conductor 563 may bethe same between the first conductor 561 and the second conductor 562. Avector sum of the induced magnetic fields B4 and B5 may be the thirdmagnetic field B3 by the conductors 561 to 564 described in FIG. 5. Thethird magnetic field B3 by the conductors 561 to 564 may havedirectivity pointing to a particular direction different from that of acircular magnetic field formed by a general single conducting wire. Inaddition, in FIG. 7, a line generated by connecting the second conductor562 and the fourth conductor 564 may have a first direction, and a linegenerated by connecting the first conductor 561 and the third conductor563 may have a second direction. The first direction and the seconddirection may be the same as or different from each other. The directionof the third magnetic field B3 may be determined according to the firstdirection and the second direction. A manufacturer may determine thefirst direction and the second direction in consideration of a patternin which the user places the electronic device near the POS terminal.

FIGS. 8A and 8B are diagrams illustrating an increase in the degree offreedom of the disposition of the electronic device according to variousembodiments of the present disclosure.

Referring to FIG. 8A, the electronic device 101 may induce a magneticfield B1+B2 in a direction substantially perpendicular to the display.Accordingly, when the display of the electronic device 101 is relativelyparallel to the POS terminal 301, the induced magnetic field B1+B2 mayapproach the POS terminal 301, so that transmission of an MST signal maybe good. In addition, referring to FIG. 8B, the electronic device 101may induce the magnetic field B3 in a direction substantially parallelto the display, and the magnetic field B3 may be induced by the currentapplied to the conductor, that is, the via set for the coil connection.Accordingly, when the display of the electronic device 101 is relativelyperpendicular to the POS terminal 301, the induced magnetic field B3 mayhead for the POS terminal 301, so that good transmission of the MSTsignal can be secured. Therefore, the disposition of the electronicdevice 101 may be comparatively free of the POS terminal 301.

FIG. 9A is a plan view illustrating the coil disposed on the secondlayer according to various embodiments of the present disclosure.

As illustrated in FIG. 9A, the second coil 520 and the fourth coil 540,which have the opened loop form, may be disposed on the second layer. Inaddition, an input pattern 550 may be disposed on the second layer. Asthe second coil 520 has the opened loop form, the start point 521 of thesecond coil 520 and the end point 522 of the second coil 520 may have aninterval therebetween. Further, the input pattern 550 and the secondcoil 520 may have an interval 901 therebetween. As the input pattern 550and the second coil 520 have the interval 901 therebetween, anadditional coil 910 may be further disposed on the second layer. Forexample, the additional coil 910 may have a width of l1 and the interval901 may be two times the width l1 or larger. Accordingly, an input partand an output part, that is, an input/output pattern may be alsodisposed within the interval 901 such that the additional coil 910 isdisposed within the second coil 520. The additional coil 910 may havethe same purpose as or different purpose from that of the coils 510 to540. For example, when the coils 510 to 540 are for MST, the additionalcoil 910 may also be a coil for MST to supplement a null area, whichwill be described below in more detail. Alternatively, the additionalcoil 910 may be a coil for wireless charging or another typecommunication (for example, NFC communication).

That is, as described above, as the coils disposed on at least one layerhave the opened loop form, another additional coil may be disposedwithin the coil of the opened loop form.

FIG. 9B is a perspective view illustrating a structure in which theadditional coil is disposed according to various embodiments of thepresent disclosure.

Referring to FIG. 9B, first additional coils 921 and 922 may be disposedon the inner side of other coils 911 and 912 according to an embodimentof the present disclosure. As described above, the coil 912 may have theopened loop form and, accordingly, input/output patterns 925 and 926corresponding to the first additional coils 921 and 922 may be disposedon an interval according to the opened loop form of the coil 912. Inaddition, the first additional coils 921 and 922 may be connected in avertical direction through conductors, that is, via sets 923 and 924.The coils 911 and 912 may be also connected in the vertical directionthrough via sets 913 and 914. In addition, second additional coils 931and 932 may be disposed on the outer side of the coils 911 and 912, andmay be connected in a vertical direction through via sets 933 and 934.Although FIG. 9B illustrates that sub coils are connected in parallel inthe first additional coils 921 and 922 and the second additional coils931 and 932, this is only an example, and the sub coils may be connectedin series in the first additional coils 921 and 922 and the secondadditional coils 931 and 932 to have same the structure of FIG. 5.

FIG. 10A is a plan view illustrating the first layer on which aplurality of coils are disposed according to various embodiments of thepresent disclosure. An MST coil 1020 may be disposed on the first layer.For example, the MST coil 1020 may have a winding form having five turnson the first layer and have the closed loop structure.

Referring to FIG. 10A, each start point of the MST coil 1020 may havethe closed structure from the outside by a connection part 1021connected to an end point. The MST coil 1020 may be connected to an MSTcoil 1050 on the second layer through a conductor, that is, a via set.

In addition, an additional MST pattern 1024 may be disposed on the firstlayer, and MST input/output patterns 1025 and 1026 for connecting aninput terminal and an output terminal with the MST pattern 1024 or theMST coil 1020 may be further disposed on the first layer.

An NFC coil 1010 may be disposed on the first layer. Further, NFCinput/output patterns 1012 and 1013 for connecting the NFC coil 1010 andthe input/output terminals may be disposed. The NFC coil 1010 may bedisposed on the outer side of the MST coil 1020.

A wireless charging coil 1030 may be disposed on the inner side of theMST coil 1020. The wireless charging coil 1030 may be manufactured tohave a resonant frequency defined in an induction type (for example, WPCstandard type) or a resonance type (for example, A4WP standard type). Inaddition, an NFC coil 1011 may be disposed on the inner side of thewireless charging coil 1030. In addition, input/output terminalconnection parts 1041 and 1042 for a temperature measuring circuit maybe further disposed on the first layer. A dummy pattern 1001 may bedisposed on the first layer. Further, an interval 1002 may be configuredfor separation between the NFC coil 1010 and the MST coil 1020 andseparation between the MST coil 1020 and the wireless charging coil1030. The dummy pattern 1101 may prevent cracks which may be generatedin each coil by compensating for a rigidity of a thin coil FPCB. Theinterval 1002 may reduce an effect of one coil on another. In addition,the NFC coil 1010 and the wireless charging coil 1030 may also beimplemented in the structure including a plurality of sub coilsconnected in series through the conductor, that is, the via set.

FIG. 10B is a plan view illustrating a second layer on which a pluralityof coils are disposed according to various embodiments of the presentdisclosure. An MST coil 1050 may be disposed on the second layer. TheMST coil 1050 on the second layer may be connected to the MST coil 1020on the first layer in a vertical direction through the conductor, thatis, the via set. MST input/output terminals 1053 and 1054 may bedisposed on the second layer. The current may be applied to MST coils1020 and 1050 and MST patterns 1024, 1052, and 1055 and then outputthrough the MST input/output terminals 1053 and 1054. A connection part1051 of the MST coil 1050 cannot contact the other end and thus cannotbe closed from the outside, and may have the opened loop form. As theMST coil 1050 has the opened loop form, a wireless charging coil 1031may be connected to the input/output terminals through the interval ofthe MST coil 1050. More specifically, wireless charging input/outputpatterns 1032 and 1033 may be disposed on the interval of the MST coil1050. The input/output terminals may be connected to patterns of a PCBby a connection part such as a C-CLIP. The input/output terminals may beinterchanged according to a change in plus/minus pulse phasestransmitted from a communication module. For example, one terminaloperates as an input terminal for a minus phase and operates as anoutput terminal for a plus phase.

The wireless charging coil 1031 may be connected to the wirelesscharging coil 1030 disposed on the first layer through the conductor,that is, the via set. Further, the wireless charging coil 1031 mayperform wireless charging by outputting the current corresponding to anexternal magnetic field or electromagnetic field. Alternatively, thewireless charging coil 1031 may induce the magnetic field by using theapplied current or induce the electromagnetic field by forming aresonant circuit together with another coil, so as to wirelessly chargeanother electronic device. The wireless charging coil 1031 may bedisposed on the inner side of the MST coil 1050.

An NFC coil 1012 may be disposed on the second layer. The NFC coil 1012may be connected to the NFC coil 1010 on the first layer through aconductor, that is, a via set. NFC patterns 1013 and 1014 may be alsodisposed on the second layer, and may be also connected to the NFC coil1010 or the NFC input/output patterns 1012 and 1013 on the first layerin a vertical direction through the conductor, that is, the via set. NFCinput/output terminals 1016 and 1017 may be connected to the NFCinput/output patterns 1012 and 1013 in a vertical direction through theconductor, that is, the via set and, accordingly, the NFC input/outputpatterns 1012 and 1013 may be connected to NFC coils 1010, 1011, 1012,and 1015. The NFC coil 1015 may be disposed on the inner side of the MSTcoil 1050, and may be connected to an NFC pattern 1018 as the MST coil1050 has the opened loop form. A temperature measuring circuit 1040 andinput/output terminals 1043 and 1044 for a temperature measuringcircuit, which are connected to the input/output terminal connectionparts 1041 and 1042 for the temperature measuring circuit on the firstlayer in a vertical direction through the conductors, that is, the viasets, may be disposed on the second layer. The temperature measuringcircuit 1040 may measure a temperature by heat, may be generated whenthe current is applied to each coil, and deliver the measuredtemperature to a processor, and the processor may control the size ofthe applied current based on the received temperature. Accordingly, itis possible to prevent the coils from being overheated.

As described above, according to various embodiments of the presentdisclosure, a plurality of coils have a structure in which various coilssuch as the MST coil, the wireless charging coil, and the NFC coil areconnected in a vertical direction through the conductors, that is, thevia sets, thereby increasing inductance of each coil and thusguaranteeing effective wireless charging or good transmission/receptionof signals.

FIG. 10C is a plan view illustrating overlapping of the first layerstructure of FIG. 10A and the second layer structure of FIG. 10B. InFIG. 10C, a mark of “⋅” may indicate a conductor, that is, a via set,and the conductor is disposed on a position marked by “⋅” and connectscorresponding structures of the first layer and the second layer. Asillustrated in FIG. 10C, the MST coil disposed on the first layer andthe MST coil disposed on the second layer may have a structure in whichmost parts thereof except for the connection parts 1021 and 1051 overlapeach other. An overlapping relation in the connection parts 1021 and1051 will be described in more detail with reference to FIGS. 11A to11C. In addition, the structure in which most areas of a pattern of thefirst layer and a pattern of the second layer overlap each other is onlyan example, and the electronic device according to various embodimentsof the present disclosure may have a structure in which the pattern ofthe first layer and the pattern of the second layer do not overlap eachother.

FIGS. 11A to 11C are diagrams illustrating the connection relation inthe connection parts of the coils according to various embodiments ofthe present disclosure. FIG. 11A is a plan view illustrating some of thecoils disposed on the first layer.

Referring to FIG. 11A, coils having the closed loop form may be disposedon the first layer. For example, a first coil 1101, a third coil 1103, afifth coil 1105, a seventh coil 1107, and a ninth coil 1109 may bedisposed on the first layer. The first coil 1101 may include a firstconnection part 1102 and a second connection part 1111. Although FIG.11A illustrates only particular parts of the coils and, accordingly, thefirst connection part 1102 and the second connection part 1111 seem likeseparated hardware, which are not connected to each other, the firstconnection part 1102 and the second connection part 1111 are connectedto each other and constitute the first coil 1101. In addition, the thirdcoil 1103 may be disposed on the outer side of the first coil 1101. Thethird coil 1103 may include a fifth connection part 1104 and a sixthconnection part 1112. The fifth coil 1105 may be disposed on the outerside of the third coil 1103. The fifth coil 1105 may include a ninthconnection part 1106 and a tenth connection part 1113. The seventh coil1107 may be disposed on the outer side of the fifth coil 1105. Theseventh coil 1107 may include a thirteenth connection part 1108 and afourteenth connection part 1114. The ninth coil 1109 may be disposed onthe outer side of the seventh coil 1107. The ninth coil 1109 may includea seventeenth connection part 1110 and an eighteenth connection part1115.

The first connection part 1102, the fifth connection part 1104, theninth connection part 1106, the thirteenth connection part 1108, and theseventeenth connection part 1110 may have widths smaller than thewinding pattern and have a form in which a width is reduced in an updirection of the winding pattern from the winding pattern. In addition,the second connection part 1111, the sixth connection part 1112, thetenth connection part 1113, the fourteenth connection part 1114, and theeighteenth connection part 1115 may have a form in which the width isreduced in a down direction from the winding pattern. Accordingly, forexample, the fifth connection part 1104 and the sixth connection part1112 may have a structure in which they do not overlap each other, andthe two connection parts 1104 and 1112 may be disposed together withinthe width of one winding pattern. Further, in the remaining windingpattern except for the connection parts, a sufficiently thick width issecured, and thus resistance may be reduced and a strength of theapplied current may increase.

Referring to FIGS. 11A and 11C, conductors, that is, via sets may beformed on the second connection part 1111, the sixth connection part1112, the tenth connection part 1113, the fourteenth connection part1114, and the eighth connection part 1115. For example, the conductorconnected to the sixth connection part 1112 may connect the sixthconnection part 1112 and the second coil 1127 on the second layer. Morespecifically, the conductor of the sixth connection part 1112 mayconnect the sixth connection part 1112 and the third connection part1128 of the second coil 1127 in a vertical direction. Further, theconductor of the tenth connection part 1113 may connect the tenthconnection part 1113 and the seventh connection part 1126 of the fourthcoil 1125 in a vertical direction. Further, the conductor of thefourteenth connection part 1114 may connect the fourteenth connectionpart 1114 and the eleventh connection part 1124 of the sixth coil 1123in a vertical direction. Further, the conductor of the eighteenthconnection part 1115 may connect the eighteenth connection part 1115 andthe fifteenth connection part 1122 of the eighth coil 1121 in a verticaldirection.

Referring to FIGS. 11B and 11C, the second connection part 1111 mayreceive the current from an input pattern 1140, and the current may beapplied to the first coil 1101, and to the second coil 1127 through thefourth connection part 1131 along the conductor connected to the firstconnection part 1101. Further, the conductor of the fourth connectionpart 1131 may connect the fourth connection part 1131 and the firstconnection part 1102 in a vertical direction. In addition, the currentapplied from the fourth connection part 1131 may be transferred to thethird connection part 1128 after being applied to the second coil 1127.Further, the conductor of the seventh connection part 1126 may connectthe third connection part 1128 and the sixth connection part 1112 of thethird coil 1103 in a vertical direction. Accordingly, the current inputinto the third connection part 1128 may be transferred to the sixthconnection part 1112 of the third coil 1103. The current input throughthe sixth connection part 1112 may be transferred to the fifthconnection part 1104 after being applied to the third coil 1103. Thefifth connection part 1104 may be connected to the eighth connectionpart 1132 of the fourth coil 1125. Accordingly, the fourth coil 1125receives the current from the eighth connection part 1132, and then theapplied current may be transferred to the fifth coil 1105 through theseventh connection part 1126. The current transferred from the inputpattern 1140 disposed on the second layer may be transferred to thesecond connection part 1111 through the via set 1141. According to theabove described scheme, the current input through the second connectionpart 1111 may be sequentially applied in an order of the first coil1101, the second coil 1127, the third coil 1103, . . . , the eighth coil1121, and the ninth coil 1109. In addition, the ninth coil 1109 may beconnected to the tenth coil 1135 and, accordingly, the current may beapplied to the tenth coil 1135. Accordingly, the electronic deviceaccording to various embodiments of the present disclosure may dispose acoil with 10 turns in a space in which 5 turns are possible and the sizeof a magnetic field induced when the same current is applied mayincrease according to the number of turns.

The conductors, that is, first via sets that connect the second coil1127, the fourth coil 1125, the sixth coil 1123, and the eighth coil1121 with the third coil 1103, the fifth coil 1105, the seventh coil1107, and the ninth coil 1109, respectively may be adjacent to eachother. Further, the conductors, that is, second via sets that connectthe second coil 1127, the fourth coil 1125, the sixth coil 1123, and theeighth coil 1121 with the first coil 1101, the third coil 1103, thefifth coil 1105, and the seventh coil 1107, respectively may be adjacentto each other. Directions of currents flowing in the first via sets maybe the same, directions of currents flowing in the second via sets maybe the same, and the directions of the currents flowing in the first viasets may be different from the directions of the currents flowing in thesecond via sets. Accordingly, via sets in which the currents flow in thesame direction may be adjacent to each other, thereby maximizingstrengths of induced magnetic fields formed by the first via sets andthe second via sets.

Hereinafter, a performance of the coil according to various embodimentsof the present disclosure will be compared with a performance of thecoil according to a comparative example. First, a coil structureaccording to the comparative example will be described with reference toFIGS. 12A and 12B.

Referring to FIG. 12A, in the structure according to the comparativeexample, a coil 1210 with 2 turns may be disposed on a first layer(1-layer). A coil 1220 with 2 turns may be disposed on a second layer(2-layer), and the two coils 1210 and 1220 may be connected in parallel.Such a structure may be named a parallel type coil. In the parallel typecoil, when the two coils 1210 and 1220 are connected by a pair of viasets, it may be construed equally as a short conducting wire ifresistance is very small. Accordingly, the current may be applied toonly one coil rather than to two coils having small resistance, whichmay act as a problem.

Referring to FIG. 12B, in the structure according to the comparativeexample, a coil 1230 with 2 turns may be disposed on a first layer(1-layer). A coil 1240 with 2 turns may be disposed on a second layer(2-layer), and the two coils 1230 and 1240 may be connected in seriesthrough a conductor 1241. Such a structure may be named a cascade typecoil. The cascade type coil can be designed when the number of turns ofthe coil disposed on each layer is singular, but the design may bedifficult if the number of turns of the coils disposed on each layer isplural. As illustrated in FIG. 12B, in order to connect the coil 1230 onthe first layer and the coil 1240 on the second layer in the cascadetype coil structure in series, the conductor 1241 should be manufacturedin an inwardly bent form, which requires a very difficult design schemein that the via set can be designed only in a vertical direction.Alternatively, in order to manufacture the cascade type coil, oneadditional layer for changing a direction of the conductor should beinserted between the first layer and the second layer, which results inincreasing a mounting thickness.

In contrast to the comparative examples according to FIGS. 12A and 12B,a first coil with one winding on the first layer may be connected to asecond coil with one winding on the second layer in series, the secondcoil on the second layer may be connected to a third coil with onewinding on the first layer, and the third coil may be connected to afourth coil with one winding on the second layer in the structureaccording to the present disclosure. The structure according to presentdisclosure may be named a spiral type coil.

Table 1 below corresponds to a table for a comparison between electricalcharacteristics of the coils according to the comparative examples andthe coil, that is, the spiral type coil according to an embodiment ofthe present disclosure.

TABLE 1 Thickness Inductance Resistance Coil type (mm) (uH) (ohm)Parallel type coil 122.8 17.9 1.873 Cascade type coil 122.0 17.9 1.495Spiral type coil 122.0 17.89 1.432 (coil according to the embodiment ofthe present disclosure)

All materials of the coils in Table 1 above are the same and aredisposed within the same space. As noted through FIG. 1, resistance ofthe parallel type coil is the highest and inductances may have similarvalues.

FIG. 13 is a graph of an MST signal recognition success rate accordingto various embodiments of the present disclosure.

Referring to FIG. 13, an area indicated by reference numeral “1301” mayrefer to the recognized area according to the embodiment of the presentdisclosure, which corresponds to an area having a success rate largerthan a preset threshold. Reference numeral “1302” refers to therecognized area for the cascade type coil, and reference numeral “1303”refers to the recognized area for the parallel type coil. The recognizedarea may be area of which strength of received signal is larger thanpredetermined threshold. As noted through FIG. 13, the spatial area ofthe recognized area of the coil according to the embodiment of thepresent disclosure may be the largest, which may mean that a coilrecognizable range according to the present disclosure is the widest.Particularly, as shown in Table 1 above, the coil according to theembodiment of the present disclosure has the widest recognition successarea by the coil even though inductances of the coil according to theembodiment of the present disclosure and the remaining coils havesimilar values, which may mean that the magnetic field additionallyformed by the conductor, that is, the via set distributes to therecognition success. Table 2 below shows recognition success ratesaccording to a distance between the electronic device and the POSterminal.

TABLE 2 Distance Distance Distance between between between electronicelectronic electronic device and device and device and POS POS POSterminal is terminal is terminal is Coil type 1 cm 3 cm 5 cm Paralleltype coil 49.21% 46.56% 19.05% Cascade type coil 51.85% 52.91% 34.92%Spiral type coil 58.73% 58.20% 38.10% (coil according to the embodimentof the present disclosure)

As noted through Table 2 above, the coil according to the embodiment ofthe present disclosure has a higher recognition success rate than thatof the coil according to the comparative example. Particularly, as shownin Table 1 above, the coil according to the embodiment of the presentdisclosure has the highest recognition success rate even thoughinductances of the coil according to the embodiment of the presentdisclosure and the remaining coils have similar values, which may meanthat the magnetic field additionally formed by the conductor, that is,the via set contributes to the recognition success.

FIGS. 14A to 14C illustrate a coil in a three layered structureaccording to various embodiments of the present disclosure. FIG. 14Aillustrates a pattern of a first layer, FIG. 14B illustrates a patternof a second layer, and FIG. 14C illustrates a pattern of a third layer.In FIGS. 14A to 14C, a description of the part that overlaps FIGS. 10Aand 10B will be omitted. In FIGS. 14A to 14C, forms of connection partsin the three layered structure will be mainly described.

As illustrated in FIG. 14A, an MST coil 1400 may include a firstconnection part 1401 and a second connection part 1402. The firstconnection part 1401 may have a form in which a width relativelydecreases from a winding pattern to a lower end of the winding pattern.The second connection part 1402 may have a form in which a widthrelatively decreases from the winding pattern to a center of the windingpattern. In addition, the MST coil 1410 on the second layer may includea third connection part 1411 and a fourth connection part 1412. Thethird connection part 1411 may have a form in which a width relativelydecreases from the winding pattern to a center of the winding pattern.The fourth connection part 1412 may have a form in which a widthrelatively decreases from the winding pattern to an upper end of thewinding pattern. In addition, a conductor, that is, a via set formed onthe second connection part 1402 may connect the third connection part1411 and the second connection part 1402 in a vertical direction. Inaddition, the MST coil 1420 on the third layer may include a fifthconnection part 1421 and a sixth connection part 1422. The fifthconnection part 1421 may have a form in which a width relativelydecreases from the winding pattern to an upper end of the windingpattern. The sixth connection part 1422 may have a form in which a widthrelatively decreases from a winding pattern to a lower end of thewinding pattern. A conductor, that is, a via set formed on the fifthconnection part 1421 may connect the fifth connection part 1421 and thefourth connection part 1412 in a vertical direction. In addition, aconductor, that is, a via set formed on the sixth connection part 1422may connect the sixth connection part 1422 and the first connection part1401 in a vertical direction. Accordingly, the MST coil 1420 on thethird layer is connected to the MST coil 1400 on the first layer, andthe innermost coil on the third layer may be connected to a second innercoil on the first layer. Accordingly, as illustrated in FIGS. 14D and14E, an order of the connected coils may be the innermost coil on thefirst layer, the innermost coil on the second layer, and the innermostcoil on the third layer, and the innermost coil on the third layer maybe connected to the second inner coil on the first layer. FIG. 14Eillustrates parts enlarged from connection parts of FIG. 14D. Asillustrated in FIG. 14E, a seventh connection part 1461 of the coil onthe first layer may be connected to a current source through a conductor1463. A current supplied through the seventh connection part 1461 may beapplied to the innermost coil on the first layer. The current applied tothe innermost coil on the first layer may be applied to an eighthconnection part 1462. A conductor 1474 formed on the eighth connectionpart 1462 may connect the eighth connection part 1462 with a ninthconnection part 1471 of the innermost coil on the second layer.Accordingly, the current applied to the innermost coil on the firstlayer may be applied to the innermost coil on the second layer throughthe conductor 1474. The current applied to the innermost coil on thesecond layer may be applied to a tenth connection part 1472. A conductor1481 formed on the tenth connection part 1472 may connect the tenthconnection part 1472 with an eleventh connection part 1481 of theinnermost coil on the third layer. Accordingly, the current applied tothe innermost coil on the second layer may be applied to the innermostcoil on the third layer through the conductor 1481. The current appliedto the innermost coil on the third layer may be applied to a twelfthconnection part 1482. A conductor 1487 formed on the twelfth connectionpart 1482 may connect the twelfth connection part 1482 with a thirteenthconnection part 1491 of a coil adjacent to the outer side of theinnermost coil on the first layer. Accordingly, the current applied tothe innermost coil on the third layer may be applied to the coiladjacent to the outer side of the innermost coil on the first layer. Asa result, an order of coils to which the current is applied or a coilconnection order may be C₁₁, C₂₁, C₁₂, C₂₂, C₃₁, C₃₂, . . . . In C_(ij),i may denote a layer and j may denote an order of the disposition fromthe inner side. For example, C₂₁ may be a first coil from the inner sideon the second layer, and C₃₂ may be a second coil from the inner side onthe third layer.

In addition, a width of the winding pattern of the MST coil may furtherincrease in comparison with the width of the winding pattern on twolayers. This may be caused from connection parts 1451, 1452, and 1453 ina form in which widths decrease in three directions with respect to onewinding pattern 1450 as illustrated in FIG. 14F. That is, since theconnection parts 1451, 1452, and 1453 have three forms and the widths ofthe connection parts 1451, 1452, and 1453 should be sufficientlysecured, the width of the winding pattern 1450 may be wider than that ofthe winding pattern on two layers. However, as the width of the windingpattern increases, the number of turns on three layers may be smallerthan the number of turns on two layers. For example, in FIGS. 14A to14C, the number of turns of the coil on each layer may be 4, which maybe smaller than the number of turns in FIGS. 10A and 10B that is 5.However, the total number of turns of the coils on the three layers maybe 4×3=12 and the total number of turns of the coils on the two layersmay be 5×2=10, so that the total number of turns of the coils on thethree layers may be larger. As the total number of turns increases,inductance may also increase. Further, as the width of the windingpattern is wider compared to the coil on the second layer, resistance ofthe winding pattern may decrease and thus size of the applied currentmay increase. In addition, intervals 1423 and 1424 between coils areprovided, thereby minimizing interference of each coil. As describedabove, the coils according to various embodiments of the presentdisclosure may be implemented in the three layered structure, and thereis no limitation in the number of layers of the coils.

FIGS. 15A and 15B are graphs of recognition success rates according to alocation for a comparison between performances of the coils in the threelayered structure according to various embodiments of the presentdisclosure and the coils in the three layered structure according to thecomparative example. Table 3 below illustrates a comparison betweenelectrical characteristics of the coils according to the comparativeexample and the coil, that is, the spiral type coil according to theembodiment of the present disclosure.

TABLE 3 Thickness Inductance Resistance Coil type (mm) (uH) (ohm)Cascade type coil 137.5 25.00 1.567 Spiral type coil 136.0 25.10 1.576(coil according to the embodiment of the present disclosure)

All materials of the coils in Table 3 above are the same and aredisposed within the same space. As noted through Table. 3, resistancesand inductances of the two coils may have similar values.

In addition, each of an x axis value and a y axis value may indicate acoordinate with respect to a distance and may have a unit, for example,cm in FIGS. 15A and 15B. The origin may indicate, for example, a centerpoint of the coil of the POS terminal. That is, in FIGS. 15A and 15B,the coordinate (a, b) may mean that the electronic device according tothe present disclosure is disposed to the right side by a cm and to theupper side by b cm from the center of the coil of the POS terminal. FIG.15A illustrates a result of recognized area. For example, an areaindicated by reference numeral “1501” of FIG. 15A may refer to arecognized area according to an embodiment of the present disclosure,which corresponds to an area having a success rate larger than a presetthreshold. Reference numeral “1502” indicates a recognized area for thecascade type coil. As noted through FIG. 15A, the spatial area of therecognized area of the coil according to the embodiment of the presentdisclosure may be larger, which may mean that a coil recognizable rangeaccording to the present disclosure is relatively wide. For example, asshown in Table 3, the coil according to the embodiment of the presentdisclosure has the wider recognition success area even thoughinductances and resistances of the cascade type coil according to theembodiment of the present disclosure and the remaining coils havesimilar values, which may mean that the magnetic field additionallyformed by the conductor, that is, the via set distributes to therecognition success. For example, it is noted that the recognitionsuccess rate relatively becomes higher in the center and, accordingly, asufficient size magnetic field is formed in a null area.

In addition, FIG. 15B illustrates a recognition success rate of thecoils in the two layered structure and the coils in the three layeredstructure according to the present disclosure. In FIG. 15B, an areaindicated by reference numeral “1511” refers to a recognized area forthe coils in the three layered structure according to an embodiment ofthe present disclosure and an area indicated by reference numeral “1512”refers to a recognized area for the coils in the two layered structureaccording to an embodiment of the present disclosure. As noted in FIG.15B, the spatial area of the recognized area of the coils in the threelayered structure may be larger, which may mean that a recognizablerange of the coils in the three layered structure according to thepresent disclosure is relatively wider than that of the coils in the twolayered structure. This may be associated with the coils in the threelayered structure that have higher inductance than that of the coils inthe two layered structure.

Table 4 below shows recognition success rates according to a distancebetween the electronic device and the POS terminal.

TABLE 4 Distance Distance Distance between between between electronicelectronic electronic device and device and device and POS POS POSterminal is terminal is terminal is Coil type 1 cm 3 cm 5 cm Cascadetype coil in 58.73% 58.20% 38.10% two layered structure Cascade typecoil in 63.49% 60.32% 43.39% three layered structure Spiral type coil in51.85% 52.91% 34.92% two layered structure (coil according to theembodiment of the present disclosure) Spiral type coil in 53.97% 55.03%37.57% three layered structure (coil according to the embodiment of thepresent disclosure)

As noted through Table 4 above, the coil according to the embodiment ofthe present disclosure has a higher recognition success rate than thatof the coil according to the comparative example and, in particular, thecoils in the three layered structure may have a higher recognitionsuccess rate than that of the coils in the two layered structure. Forexample, as shown in Table 3 above, the coil according to the embodimentof the present disclosure has the highest recognition success rate eventhough inductances of the coil according to the embodiment of thepresent disclosure and the cascade type coil have similar values, whichmay mean that the magnetic field additionally formed by the conductor,that is, the via set distributes to the recognition success.

FIGS. 16A and 16B illustrate coils disposed on a wearable electronicdevice, for example, a wrist watch type wearable electronic device. Thewrist watch type wearable electronic device may have, for example, acircular housing.

Referring to FIG. 16A, a first MST coil 1610 may be disposed on a firstlayer 1600. As illustrated in FIG. 16B, a second MST coil 1630 may bedisposed on a second layer 1640. In addition, the first MST coil 1610may be connected to the second MST coil 1630 through a first conductor1621, that is, a via set, and the second MST coil 1630 may be alsoconnected to the first MST coil 1610 through a second conductor 1641,that is, a via set. The first MST coil 1610 and the second MST coil 1630may have a circular winding form. That is, the first MST coil 1610 andthe second MST coil 1630 may have a winding form corresponding to thehousing form

In addition, the first MST coil 1610 may be connected to an input/outputterminal 1602 through an input/output pattern 1611, and the second MSTcoil 1630 may be connected to an input/output terminal 1603 through aninput/output pattern 1631. In addition, the first MST coil 1610 may havea closed loop form, and the second MST coil 1630 may have an opened loopform. Accordingly, an additional coil may be further disposed on theinner side of the first MST coil 1610 and the second MST coil 1630, andan input/output pattern for the additional coil may be disposed betweena start point and an end point of each of the second MST coils 1630. Inthe embodiments of FIGS. 16A and 16B, a width of the winding pattern maybe 0.4 mm and the number of turns on each layer may be 9. Accordingly,the total number of turns of coils may be 18. In addition, as describedin connection with FIG. 5, the connection relation of coils may have thespiral form in which the end point of the coil on the first layer isconnected to the start point of the coil on the second layer through thevia set and the end of the coil on the second layer is connected to thestart point of the next coil on the first layer through another via set.

FIGS. 17A to 17C illustrate coils in a three layered structure accordingto various embodiments of the present disclosure.

Referring to FIG. 17A, a first MST coil 1710 may be disposed on a firstlayer 1700, a second MST coil 1731 may be disposed on a second layer1740, and a third MST coil 1752 may be disposed on a third layer 1770.The first MST coil 1710 may be connected to an input/output terminal1702 through an input/output pattern 1711, and the third MST coil 1752may be connected to an input/output terminal 1705 through aninput/output pattern 1751. The first MST coil 1710 may be connected tothe second MST coil 1731 through a first conductor 1721, the second MSTcoil 1731 may be connected to the third MST coil 1752 through a secondconductor 1732, and the third MST coil 1752 may be connected to thefirst MST coil 1710 through a third conductor 1753. In FIGS. 17A to 17C,a width of the winding pattern may be 0.8 mm and the number of turns oneach layer may be 14. Accordingly, the total number of turns of coilsmay be 42. In addition, an FPCB on which the coils of FIGS. 17A to 17Care disposed may be implemented to have the same thickness as that ofthe FPCB on which the coils of FIGS. 16A and 16B are disposed. Since thewidth of the winding pattern is 0.8 mm, which is wider than that ofFIGS. 16A and 16B, a resistance may remain in the similar value eventhough the whole coil becomes longer. That is, the coils of FIGS. 17A to17C may have a relatively high inductance while having a similarresistance to that of the coils of FIGS. 16A and 16B.

FIGS. 18A and 18B illustrate recognition success rates according to alocation for a comparison between performances of circular coils in thetwo layered structure and circular coils in three layered structureaccording to various embodiments of the present disclosure. Table 5below illustrates a comparison between electrical characteristics of thecircular coils in the two layered structure and the circular coils inthe three layered structure.

TABLE 5 Thickness Inductance Resistance Coil type (mm) (uH) (ohm)Circular coils in two 137.5 25.00 1.824 layered structure 136.0 46.101.827 Circular coils in three layered structure

All materials of the coils in Table 5 above are the same and aredisposed within the same space. As noted through FIG. 5, resistances ofthe two coils may have similar values. That is, even though the totallength of circular coils in the three layered structure is relativelylonger than the circular coils in the two layered structure, as a widthis relatively larger, the resistance may remain in the similar value.

FIGS. 18A and 18B illustrate results of recognized area according tovarious embodiments. For example, areas indicated by reference numerals“1801” and “1802” of FIG. 18A may refer to recognized areas according tothe circular coils in the two layered structure, which correspond toareas having a success rate larger than a preset threshold. Referencenumerals “1811” and “1812” indicate recognized areas for the circularcoils in the three layered structure. As noted through FIG. 18B, thespatial area of the circular coils in the three layered structureaccording to the embodiment of the present disclosure may be larger,which may mean that a coil recognizable range according to the presentdisclosure is relatively wide. In particular, it is noted that therecognition success rate relatively becomes higher in the center and,accordingly, a sufficient size magnetic field is formed in a null area.Further, an effect of the magnetic field by the conductor, that is, thevia set can be identified in that the recognition success rate in leftand right areas of the center is higher in FIGS. 18A and 18B.

Table 6 below shows recognition success rates according to a distancebetween the electronic device and the POS terminal.

TABLE 6 Distance Distance Distance between between between electronicelectronic electronic device and device and device and POS POS POSterminal is terminal is terminal is Coil type 1 cm 3 cm 5 cm Circularcoils in two 56.41% 60.68% 26.50% layered structure Circular coils inthree 58.12% 64.96% 34.19% layered structure

As noted through Table 6, the recognition success rate larger than 60%can be acquired even in the distance of 3 cm, which is a recommended MSTdistance, and good transmission/reception of the MST signal can beguaranteed even in a small electronic device such as a wearableelectronic device.

FIGS. 19 and 20 illustrate circular coils in various two layered andthree layered structures according to the present disclosure. Thecircular coils of FIGS. 19 and 20 may be disposed in a particulardirection based on the housing.

Referring to FIG. 19, it is noted that input/output terminals 1901 and1902 and input/output patterns 1911 and 1912 lean to a particulardirection. Accordingly, first via sets 1921 to 1929 to which the currentis applied in a first direction, and second via sets 1931 to 1939 towhich the current is applied in a second direction may also lean in aparticular direction. Directions of magnetic fields formed by the firstvia sets 1921 to 1929 and the second via sets 1931 to 1939 may also headin a particular direction. Accordingly, the circular coils may bedesigned to be arranged in at a particular direction to allow themagnetic fields formed by the via sets to direct at the POS terminalaccording to a way in which the user makes the wearable electronicdevice approach the POS terminal while wearing the wearable electronicdevice.

Referring to FIG. 20, input/output terminals 2001 and 2002 andinput/output patterns 2011 and 2012 lean to a particular direction inthe coils in the three layered structure. Further, via sets 2020 towhich the current is applied in a first direction and via sets 2030 towhich the current is applied in a second direction may also direct at aparticular direction. Accordingly, induced magnetic fields formed by thevia sets 2020 and 2030 may also head in a particular direction.

As illustrated in FIGS. 19 and 20, the coils according to variousembodiments of the present disclosure may form not only the magneticfield by the circular coils but also the magnetic field by theconductor, that is, the via set disposed in a direction perpendicular tothe circular coils, and also control a directed direction of the formedmagnetic field by controlling a location of the via set.

FIG. 21 is a block diagram of an electronic device according to variousembodiments of the present disclosure.

As illustrated in FIG. 21, the electronic device may include coilsdisposed on a plurality of layers, for example, a coil 2110 by FIG. 5.In the embodiment of FIG. 21, the coil 2110 is used as the MST coil. Thecoil 2110 may be connected to a driver 2120. The driver 2120 may includea charge pump circuit and an over current protection (OCP) circuit. Thecharge pump circuit cannot produce power by itself, but may receivepower from another power provider 2130. The power providing circuit unit2130 may include a power switch circuit for preventing direct connectionto a battery and may be enabled by a controller 2153. The driver 2120may receive the current from the power provider 2130, receive MST datafrom a processor 2150, for example, an MST data generator 2152 and thenmay be automatically enabled. The driver 2120 may generally have oneinput and output terminal, which may be divided into two input andoutput terminals by an internal logic of the driver 2120. The driver2120 may apply input/output signals 2111 and 2112, that is the currentto the coil 2110, and the coil 2110 may induce an induced magnetic fieldaccording to the applied current. The driver 2120 may be a circuit whichcan generate an output current based on amplification of MST data and aninput pulse signal.

A card code manager 2151 may be a logic part for encrypting and managingcard information registered by the user. The MST data generator 2152 maybe a logic part for receiving card encryption information from the cardcode manager 2151 and generating a signal for payment based on the cardencryption information. A profile identifier 2154 may be a logic partfor performing authentication processing on user input information basedon a user profile. A profile manager 2155 may be a logic part forgenerating a profile and managing a pre-stored user profile. A sensor2140 may be a circuit for acquiring user biometric information such as afingerprint, HRM, touch, and image. More specifically, the sensor 2140is a circuit for acquiring user approval information required during apayment process, and may be implemented in various forms such as animage acquisition circuit for acquiring an image for face recognition,finger recognition, and iris recognition, a touch screen for recognizinga finger, ear shape, and hand pattern, electrodes for ECG recognitionand HRM recognition, and a microphone for voice recognition.

When a payment application is executed, the electronic device mayacquire card information form the card code manager 2151. The electronicdevice may acquire user biometric information from the sensor 2140. Theprofile identifier 2154 may perform user authentication by using theuser biometric information and the card information. When the user isauthenticated, the MST signal generator 2152 may generate an MST signal.The driver 2120 and the power provider 2130 may transmit the generatedMST signal to the coil 2110. The coil 2110 may induce the inducedmagnetic field in accordance with the received MST signal. The MSTsignal may be a signal changing according to time and, accordingly, astrength of the induced magnetic field induced from the coil 2110 mayalso change according to time. The POS terminal may recognize theinduced magnetic field having the strength changing according to timeand, accordingly, perform payment or relay payment information to theserver. In this document, the MST signal may be also named a magneticsignal and, in this case, the MST signal generator 2152 may be named amagnetic signal generating circuit.

FIG. 22 is a rear perspective view illustrating the electronic devicewhen a case 2201 of the electronic device is opened according to variousembodiments of the present disclosure.

A housing 2220 may be disposed on the rear surface of the electronicdevice. A first NFC coil 2270 may be disposed at the center of thehousing 2220, and a wireless charging coil 2260 may be disposed on theouter side of the first NFC coil 2270. An MST coil 2280 may be disposedon the outer side of the wireless charging coil 2260. A second NFC coil2290 may be disposed on the outer side of the MST coil 2280. A dummypattern 2210 may be disposed on the outer side of the second NFC coil2290. In addition, although coils on the rear surface are illustrated asbeing disposed on a single layer, the coils may be implemented in astructure including a multi-layer structure and conductors in a verticaldirection, for example, the structure of FIG. 5. A battery 2250 may bedisposed below the second NFC coil 2290. The housing 2220 may be cut offat the part where the battery 2250 is disposed. A camera 2230 and asensor 2240 may be disposed above the second NFC coil 2290. An FPCB onwhich the MST coil 2280 is disposed may adhere to the housing 2220 orthe battery 2250. In order to avoid overlapping between the FPCB andelements such as the camera 2230 and the sensor 2240, a coil pattern maybe implemented by a bypass design. Another member may be adhered to atleast one of the upper surface and the lower surface of the FPCB. Forexample, a heat radiating material (for example, a graphite sheet) forpreventing thermal diffusion or a shielding material (for example, ashielding sheet) for preventing another element from being damaged by astrong induced magnetic field may be adhered to at least one of theupper surface and the lower surface of the FPCB. A protection film forpreventing damage of the FPCB may be adhered to at least one of theupper surface and the lower surface of the FPCB.

FIG. 23 is a cross-sectional view illustrating an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIG. 23, a display 2352 may be disposed relatively on thelower side of the electronic device. A bracket 2351 may be disposedabove the display 2352 and a camera 2341 may be displayed on the bracket2351. In addition, a receiver 2342 may be disposed beside the display2352 and the bracket 2351. A PCB 2352 on which a plurality of devicesare mounted and a battery 2330 may be disposed above the bracket 2351. Ahousing 2331 may be disposed above the PCB 2352. Coils 2302, 2311, 2312,and 2303 may be disposed above the housing 2331 and the battery 2330.For example, the coils 2302 and 2303 may be MST coils, and the coils2311 and 2312 may be wireless charging coils. As illustrated in FIG. 23,the coils 2302, 2311, 2312, and 2303 may have a structure of multiplelayers, and a conductor for connecting layers, that is, a via set, whichis not illustrated, may be disposed. In addition, the electronic devicemay further include an additional pattern 2301 for securing anadditional magnetic field strength. A protection film 2321 may bedisposed on the coils 2302, 2311, 2312, and 2303, and a cover (forexample, glass) may be disposed on the protection film 2321. Inaddition, an adhesive layer 2324, a graphite sheet 2323, and aprotection sheet 2322 may be disposed between the battery 2330 and thecoils 2302, 2311, 2312, and 2303. A bracket 2331 may be disposed besidethe electronic device and protect internal devices.

FIG. 24 illustrates laminated structures of FPCBs on which coils in atwo layered structure and coils in a three layered structure aredisposed according to various embodiments of the present disclosure.

Referring to FIG. 24A, in the coils in the two layered structure, asubstrate (base) includes a polyimide film (PI) and copper layers (Cu)disposed on both sides of the polyimide film (PI). According to anembodiment, a thickness of the polyimide film (PI) may be 12.5 mm, and athickness of each of the copper layers (Cu) may be 35 mm. Plating layers(plating) may be disposed on both sides of the substrate (base) and mayinclude, for example, copper plating layers (Cu-plating). The platinglayer (plating) may have a thickness, for example, 10 mm. Cover films(covery) may be disposed above the upper plating layer (plating) andbelow the lower plating layer (plating). The cover film (covery) mayinclude an adhesive layer (adhesive) for adhesion with the plating layer(plating) and a polyimide film (PI). For example, the adhesive layer(adhesive) may have a thickness of 5 mm, and the polyimide film (PI) mayhave a thickness of 5 mm. In addition, not illustrated, a conductor,that is, a via set for connecting the copper layers (Cu) in a verticaldirection may be formed, and the via set may connect the copper layers(Cu) through an opening formed on the polyimide film (PI) disposedbetween the copper layers (Cu).

Referring to FIG. 24B, a substrate (base) including two copper layers(Cu) and a substrate (base) including one copper layer (Cu) may bedisposed on the FPCB including coils in the three layered structure. Forexample, one substrate (base) may include a polyimide film (PI) and twocopper layers (Cu) disposed on both sides of the polyimide film (PI).The other substrate (base) may include a polyimide film (PI) and acopper layer (Cu) disposed below the polyimide film (PI). The copperlayers (Cu) may have a thickness of 18 mm each, and the polyimide film(PI) may have a thickness of 12.5 mm. In addition, an adhesive layer(bonds or adhesive) may be disposed between the two substrates (base) toconnect them and may have a thickness of, for example, 13 mm. Inaddition, a plating layer (plating) may be disposed above the copperlayer (Cu) of one substrate (base), and the plating layer (plating) mayinclude, for example, a copper plating layer (Cu-plating). The platinglayer (plating) may have a thickness of, for example, 10 mm. Further,the plating layer (plating) may be disposed below the copper layer (Cu)of the other substrate (base), and the plating layer (plating) mayinclude, for example, a copper plating layer (Cu-plating). Cover films(covery) may be disposed above the upper plating layer (plating) andbelow the lower plating layer (plating). The cover film (covery) mayinclude an adhesive layer (adhesive) for adhesion with the plating layer(plating) and a polyimide film (PI). For example, the adhesive layer(adhesive) may have a thickness of 5 mm, and the polyimide film (PI) mayhave a thickness of 5 mm.

FIG. 25 is a plan view illustrating a coil pattern according to variousembodiments of the present disclosure.

Referring to FIG. 25, the electronic device according to the presentdisclosure may include an MST coil 2530. An NFC coil 2540 may bedisposed on the outer side of the MST coil 2530, and a wireless chargingcoil 2510 may be disposed on the inner side of the MST coil 2530. Inaddition, a magnetic field strength may be relatively weak at the centerof the MST coil 2530 and, in this case, a null area may be generated.Accordingly, the electronic device according to various embodiments ofthe present disclosure may further include an additional MST coil 2520disposed on the inner side of the wireless charging coil 2510 tocompensate for the null area. The generation of the null area may beprevented by the magnetic field of the additional MST coil 2520.

Each of the components of the electronic device according to the presentdisclosure may be implemented by one or more components and the name ofthe corresponding component may vary depending on a type of theelectronic device. In various embodiments, the electronic device mayinclude at least one of the above-described elements. Some of theabove-described elements may be omitted from the electronic device, orthe electronic device may further include additional elements. Further,some of the components of the electronic device according to the variousembodiments of the present disclosure may be combined to form a singleentity, and thus, may equivalently execute functions of thecorresponding elements prior to the combination.

The term “module” as used herein may, for example, mean a unit includingone of hardware, software, and firmware or a combination of two or moreof them. The “module” may be interchangeably used with, for example, theterm “unit”, “logic”, “logical block”, “component”, or “circuit”. The“module” may be a minimum unit of an integrated component element or apart thereof. The “module” may be a minimum unit for performing one ormore functions or a part thereof. The “module” may be mechanically orelectronically implemented. For example, the “module” according to thepresent disclosure may include at least one of an application specificintegrated circuit (ASIC) chip, a field programmable gate array (FPGA),and a programmable-logic device for performing operations which has beenknown or are to be developed hereinafter.

According to various embodiments, at least some of the devices (forexample, modules or functions thereof) or the method (for example,operations) according to the present disclosure may be implemented by acommand stored in a computer-readable storage medium in a programmingmodule form. When the command is executed by one or more processors (forexample, the processor 120), the one or more processors may execute afunction corresponding to the command. The computer-readable storagemedium may be, for example, the memory 130.

The computer readable recoding medium may include a hard disk, a floppydisk, magnetic media (e.g., a magnetic tape), optical media (e.g., acompact disk ROM (CD-ROM) and a DVD), magneto-optical media (e.g., afloptical disk), a hardware device (e.g., a ROM, a RAM, a flash memory),and the like. In addition, the program instructions may include highclass language codes, which can be executed in a computer by using aninterpreter, as well as machine codes made by a compiler. Theaforementioned hardware device may be configured to operate as one ormore software modules in order to perform the operation of the presentdisclosure, and vice versa.

The programming module according to the present disclosure may includeone or more of the aforementioned components or may further includeother additional components, or some of the aforementioned componentsmay be omitted. Operations executed by a module, a programming module,or other component elements according to various embodiments of thepresent disclosure may be executed sequentially, in parallel,repeatedly, or in a heuristic manner. Further, some operations may beexecuted according to another order or may be omitted, or otheroperations may be added.

Various embodiments disclosed herein are provided merely to easilydescribe technical details of the present disclosure and to help theunderstanding of the present disclosure, and are not intended to limitthe scope of the present disclosure. Therefore, it is intended that allmodifications and changes or modified and changed forms based on thepresent disclosure fall within the scope of the present disclosure asdefined by the appended claims and their equivalents.

What is claimed is:
 1. A portable communication device, comprising: ahousing including a rear cover; a battery disposed in the housing; nearfield communication (NFC) circuitry; wireless charging circuitry;magnetic secure transmission (MST) circuitry; a flexible printed circuitboard (FPCB) including a plurality of layers substantially parallel toeach other, at least a portion of the FPCB being disposed between thebattery and the rear cover; an NFC coil electrically connected with theNFC circuitry, the NFC coil including a first portion formed withrespect to one of the plurality of layers of the FPCB and a secondportion formed with respect to another one of the plurality of layers ofthe FPCB; a wireless charging coil electrically connected with thewireless charging circuitry, the wireless charging coil including athird portion formed with respect to one of the plurality of layers ofthe FPCB and a fourth portion formed with respect to another one of theplurality of layers of the FPCB; and an MST coil electrically connectedwith the MST circuitry, the MST coil including a fifth portion formedwith respect to one of the plurality of layers of the FPCB and a sixthportion formed with respect to another one of the plurality of layers ofthe FPCB, wherein, when viewed in a direction substantiallyperpendicular to a rear surface of the portable communication device,the first portion is at least partially surrounded by the fifth portionand the third portion is located between the first portion and the fifthportion, wherein, when viewed in the direction substantiallyperpendicular to the rear surface of the portable communication device,the second portion is at least partially surrounded by the sixth portionand the fourth portion is located between the second portion and thesixth portion, and wherein the sixth portion is formed as an opened loopwith a region unoccupied by the MST coil between an inside of the openedloop and an outside of the opened loop, and the second portion isconnected with the NFC circuitry via a conductor disposed through theregion.
 2. The portable communication device of claim 1, wherein the NFCcoil further includes a seventh portion formed in or on at least one ofone of the layers and another one of the layers, the seventh portion atleast partially surrounding a corresponding one of the fifth portion andthe sixth portion.
 3. The portable communication device of claim 1,wherein, when viewed in the direction substantially perpendicular to therear surface of the portable communication device, the conductor is atleast partially intersected with at least one of the third portion andthe fifth portion.
 4. The portable communication device of claim 1,wherein the fifth portion is formed as a closed loop.
 5. The portablecommunication device of claim 1, wherein the fourth portion is connectedwith the wireless charging circuitry via a second conductor disposedthrough the region.
 6. The portable communication device of claim 5,wherein, when viewed in the direction substantially perpendicular to therear surface of the portable communication device, the second conductoris at least partially intersected with the fifth portion.
 7. A portablecommunication device, comprising: near field communication (NFC)circuitry; wireless charging circuitry; magnetic secure transmission(MST) circuitry; a flexible printed circuit board (FPCB) including afirst substrate layer and a second substrate layer; an NFC coilelectrically connected with the NFC circuitry, the NFC coil including afirst portion formed on the first substrate layer and a second portionformed on the second substrate layer; a wireless charging coilelectrically connected with the wireless charging circuitry, thewireless charging coil including a third portion formed on the firstsubstrate layer and a fourth portion formed on the second substratelayer; and an MST coil electrically connected with the MST circuitry,the MST coil including a fifth portion formed on the first substratelayer and a sixth portion formed on the second substrate layer, whereinthe first portion is at least partially surrounded by the fifth portionand the third portion is located between the first portion and the fifthportion, wherein the second portion is at least partially surrounded bythe sixth portion and the fourth portion is located between the secondportion and the sixth portion, and wherein the sixth portion is formedas an opened loop with a region unoccupied by the MST coil between aninside of the opened loop and an outside of the opened loop, and thesecond portion is connected with the NFC circuitry via a conductordisposed through the region.
 8. The portable communication device ofclaim 7, wherein the NFC coil further includes a seventh portion formedon at least one of the first and second substrate layers, the seventhportion at least partially surrounding a corresponding one of the fifthportion and the sixth portion.
 9. The portable communication device ofclaim 7, wherein, when viewed in a direction substantially perpendicularto a rear surface of the portable communication device, the conductor isat least partially intersected with at least one of the third portionand the fifth portion.
 10. The portable communication device of claim 7,wherein the fifth portion is formed as a closed loop.
 11. The portablecommunication device of claim 7, wherein the fourth portion is connectedwith the wireless charging circuitry via a second conductor disposedthrough the region.
 12. The portable communication device of claim 11,wherein, when viewed in a direction substantially perpendicular to arear surface of the portable communication device, the second conductoris at least partially intersected with the fifth portion.
 13. A portablecommunication device, comprising: near field communication (NFC)circuitry; wireless charging circuitry; magnetic secure transmission(MST) circuitry; a flexible printed circuit board (FPCB) including afirst substrate layer and a second substrate layer; an NFC coilelectrically connected with the NFC circuitry, the NFC coil including afirst portion formed on the first substrate layer and a second portionformed on the second substrate layer, wherein at least part of the firstportion is connected to at least part of the second portion through atleast one first conductor formed through the FPCB; a wireless chargingcoil electrically connected with the wireless charging circuitry, thewireless charging coil including a third portion formed on the firstsubstrate layer and a fourth portion formed on the second substratelayer, wherein at least part of the third portion is connected to atleast part of the fourth portion through at least one second conductorformed through the FPCB; an MST coil electrically connected with the MSTcircuitry, the MST coil including a fifth portion formed on the firstsubstrate layer and a sixth portion formed on the second substratelayer, wherein at least part of the fifth portion is connected to atleast part of the sixth portion through at least one third conductorformed through the FPCB; at least one fourth conductor connecting theNFC coil to the NFC circuitry, wherein at least part of the at least onefourth conductor is connected to at least part of the NFC coil throughat least one fifth conductor formed through the FPCB; and at least onesixth conductor connecting the wireless charging coil to the wirelesscharging circuitry, wherein at least part of the at least one sixthconductor is connected to at least part of the wireless charging coilthrough at least one seventh conductor formed through the FPCB.
 14. Theportable communication device of claim 13, wherein, when viewed in adirection substantially perpendicular to a rear surface of the portablecommunication device, the first portion is at least partially surroundedby the fifth portion and the third portion is located between the firstportion and the fifth portion, and wherein, when viewed in the directionsubstantially perpendicular to the rear surface of the portablecommunication device, the second portion is at least partiallysurrounded by the sixth portion and the fourth portion is locatedbetween the second portion and the sixth portion.
 15. The portablecommunication device of claim 13, wherein the sixth portion is formed asan opened loop with a region unoccupied by the MST coil between aninside of the opened loop and an outside of the opened loop, and thesecond portion is connected with the NFC circuitry via an eighthconductor disposed through the region of the at least one fourthconductor.
 16. The portable communication device of claim 15, whereinthe at least one third conductor includes a first via group connecting afirst end part of the opened loop to the fifth portion and a second viagroup connecting a second end part of the opened loop to the fifthportion.
 17. The portable communication device of claim 13, wherein thefourth portion is formed as an opened loop with a region unoccupied bythe wireless charging coil between an inside of the opened loop and anoutside of the opened loop, such that the second portion is connectedwith the NFC circuitry via an eighth conductor disposed through theregion of the at least one fourth conductor.
 18. The portablecommunication device of claim 17, wherein the at least one secondconductor includes third via group connecting a first end part of theopened loop to the third portion and fourth via group connecting asecond end part of the opened loop to the third portion.
 19. Theportable communication device of claim 13, wherein the NFC coil furthercomprises a seventh portion formed in or on at least one of one of thelayers and another one of the layers, the seventh portion at leastpartially surrounding a corresponding one of the fifth portion and thesixth portion.
 20. The portable communication device of claim 13,wherein, when viewed in a direction substantially perpendicular to arear surface of the portable communication device, the at least onefourth conductor is at least partially intersected with at least one ofthe third portion and the fifth portion.